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Squeeze out TSMC! Intel wins MediaTek's large contract for foundry work

Squeeze out TSMC! Intel wins MediaTek's large contract for foundry work

Source:本站Time:2022-07-26Views:

Today (26th), Intel and MediaTek announced a strategic partnership to manufacture chips using the advanced process of Intel Foundry Services (IFS). This is one of the most significant deals Intel has announced since launching its foundry business earl…

Today (26th), Intel and MediaTek announced a strategic partnership to manufacture chips using the advanced process of Intel Foundry Services (IFS). This is one of the most significant deals Intel has announced since launching its foundry business early last year.


According to reports, MediaTek plans to use Intel's process technology to manufacture a variety of chips for a series of smart terminal products. Building on a roadmap from production-proven 3D FinFET transistors to next-generation technology breakthroughs, IFS offers a broad manufacturing platform with technologies optimized for high performance, low power consumption and continuous connectivity.


While Intel did not provide any financial details of the deal or how many chips it would make for MediaTek, it said the first products would be in production within the next 18 to 24 months and would feature a more mature technology called Intel 16. process, and its chips are used in smart devices.


"MediaTek has always adopted a multi-source strategy," MediaTek said in a statement. "In addition to maintaining close cooperation with TSMC on advanced process nodes, this cooperation will strengthen MediaTek's supply of mature process nodes."


Intel previously announced that its foundry business had signed deals with Qualcomm and Amazon.


Intel Foundry Services (IFS) announced in March 2021 that IFS is different from other foundry products. It will combine advanced process technology and packaging to deliver the promised production capacity in the United States and Europe, and support x86 cores, ARM and RISC-V ecosystem IP production.

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