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TSMC announces 2nm process technology for the first time, mass production will begin in 2025
TSMC first launched a 2nm (N2) process using a nanosheet transistor (GAAFET) architecture, which will be mass-produced in 2025.
On June 17th, at the TSMC North America Technology Forum held in the early hours of this morning, TSMC officially announced the future advanced process roadmap.
Among them, TSMC's 3nm (N3) process will be mass-produced in 2022, while TSMC's first 2nm (N2) process using the nanosheet transistor (GAAFET) architecture will be mass-produced in 2025.
The president of TSMC said in an online forum that in the rapidly changing and rapidly growing digital world, the demand for computing power and energy efficiency is increasing more rapidly than ever before, opening up unprecedented opportunities and challenges for the semiconductor industry. At a time of exciting transformation and growth, TSMC's innovations revealed at the Tech Forum demonstrate TSMC's technology leadership and commitment to supporting customers.
At the same time, TSMC's senior vice president of R&D announced at the meeting that TSMC will have the latest high-NA extreme ultraviolet (EUV) lithography equipment from lithography giant ASML in 2024. "Mainly used for research purposes by partners...to develop solutions in relevant infrastructure and formats for customer needs and drive innovation."
Time:2024-11-16
Time:2024-11-16
Time:2024-11-16
Time:2024-11-16
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