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Latest InformationIntroductionTHGBMNG5D1LBAIL is a high performance eMMC product in a 153-ball BGA package. The device features an easy-to-use, industry-standard JEDEC/MMCA version 5.0 interface that supports 1-I/O, 4-I/O, and 8-I/O modes . The THGBMNG5D1LBAIL also…
Introduction
THGBMNG5D1LBAIL is a high performance eMMC product in a 153-ball BGA package. The device features an easy-to-use, industry-standard JEDEC/MMCA version 5.0 interface that supports 1-I/O, 4-I/O, and 8-I/O modes . The THGBMNG5D1LBAIL also comes with an integrated controller that supports a high-speed memory interface compliant with JEDEC version 5.0/5.1, eliminating the need for the host processor to directly control flash memory.
Specifications
Product: THGBMNG5D1LBAIL
Memory type: non-volatile
Memory format: Flash
Technology: Flash - NAND
Storage capacity: 32Gb
Memory organization: 4G x 8
Memory interface: eMMC
Clock frequency: 200 MHz
Write cycle time - word, page: -
Voltage - Power supply: 2.7V ~ 3.6V
Operating temperature: -25°C ~ 85°C (TA)
Mounting type: Surface mount type
Package/case: 153-WFBGA
Supplier Package: 153-WFBGA (11.5x13)
Basic product number: THGBMNG5
Applications
The THGBMNG5D1LBAIL device is suitable for applications that require high data speed and capacity requirements, such as industrial, consumer electronics, multimedia, smart metering and smart lighting.
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Time:2025-01-16
Time:2025-01-16
Time:2025-01-16
Time:2025-01-16
Contact Number:86-755-83294757
Enterprise QQ:1668527835/ 2850151598/ 2850151584/ 2850151585
Business Hours:9:00-18:00
E-mail:sales@hkmjd.com
Company Address:Room1239, Guoli building, Zhenzhong Road, Futian District, Shenzhen, Guangdong
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