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(Supply) THGAMRG8T13BAIL Memory IC 32GB eMMC 5.1 3D BiCS

(Supply) THGAMRG8T13BAIL Memory IC 32GB eMMC 5.1 3D BiCS

Source:our siteTime:2025-01-10Views:

Overview:THGAMRG8T13BAIL e-MMC™ NAND FLASH uses Bit-column Stacked (BiCS) FLASH 3D technology. This flash memory provides the best solution for applications that need to store higher data volumes in a cost-effective manner. THGAM eMMC flash memory is…

Overview:

THGAMRG8T13BAIL e-MMC™ NAND FLASH uses Bit-column Stacked (BiCS) FLASH 3D technology. This flash memory provides the best solution for applications that need to store higher data volumes in a cost-effective manner. THGAM eMMC flash memory is fully compliant with Multimedia Card Association (MMCA) High Speed Memory interface standards. These flash drives comply with the latest JEDEC 5.1 release.

THGAMRG8T13BAIL.jpg

THGAM eMMC flash has integrated memory management capabilities, including error correction codes, bad block management, wear balancing, and garbage collection. These flash drives come in FBGA packages and standard (-25°C to +85°C) temperature versions. Typical applications include consumer electronics, multimedia, smart metering, and smart lighting.


Features

32GB RAM

BiCS 3D NAND technology

Multilayer cell (MLC) technology

Conforms to the latest JEDEC 5.1 release

Integrated memory management:

Error-correcting code

Bad block management

Wear equilibrium

Garbage recycling

Higher interface speed HS400, compliant with JEDEC 5.1 standard

Managed memory

High quality Toshiba MLC NAND flash memory is combined with controller developed by Toshiba

-25°C to +85°C Operating temperature range (standard)

FBGA package


Applications

industry

Consumer electronics

multimedia

Intelligent measurement

Intelligent lighting

Intelligent application


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