sales@hkmjd.com
Service Telephone:86-755-83294757
Overview:THGAMRG8T13BAIL e-MMC™ NAND FLASH uses Bit-column Stacked (BiCS) FLASH 3D technology. This flash memory provides the best solution for applications that need to store higher data volumes in a cost-effective manner. THGAM eMMC flash memory is…
Overview:
THGAMRG8T13BAIL e-MMC™ NAND FLASH uses Bit-column Stacked (BiCS) FLASH 3D technology. This flash memory provides the best solution for applications that need to store higher data volumes in a cost-effective manner. THGAM eMMC flash memory is fully compliant with Multimedia Card Association (MMCA) High Speed Memory interface standards. These flash drives comply with the latest JEDEC 5.1 release.
THGAM eMMC flash has integrated memory management capabilities, including error correction codes, bad block management, wear balancing, and garbage collection. These flash drives come in FBGA packages and standard (-25°C to +85°C) temperature versions. Typical applications include consumer electronics, multimedia, smart metering, and smart lighting.
Features
32GB RAM
BiCS 3D NAND technology
Multilayer cell (MLC) technology
Conforms to the latest JEDEC 5.1 release
Integrated memory management:
Error-correcting code
Bad block management
Wear equilibrium
Garbage recycling
Higher interface speed HS400, compliant with JEDEC 5.1 standard
Managed memory
High quality Toshiba MLC NAND flash memory is combined with controller developed by Toshiba
-25°C to +85°C Operating temperature range (standard)
FBGA package
Applications
industry
Consumer electronics
multimedia
Intelligent measurement
Intelligent lighting
Intelligent application
Time:2025-01-10
Time:2025-01-10
Time:2025-01-10
Time:2025-01-10
Contact Number:86-755-83294757
Enterprise QQ:1668527835/ 2850151598/ 2850151584/ 2850151585
Business Hours:9:00-18:00
E-mail:sales@hkmjd.com
Company Address:Room1239, Guoli building, Zhenzhong Road, Futian District, Shenzhen, Guangdong
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