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XC6SLX150-3FGG900C A low-cost, high-capacity Spartan 6 LX FPGA-Field Programmable Gate Array

XC6SLX150-3FGG900C A low-cost, high-capacity Spartan 6 LX FPGA-Field Programmable Gate Array

Source:our siteTime:2024-12-13Views:

Instructions:The XC6SLX150-3FGG900C device is a Spartan 6 LX FPGA-Field Programmable gate array IC. The Spartan-6 LX FPGA is optimized for applications that require the absolute lowest cost, support for up to 150K logical unit density, 4.8Mb memory, i…

Instructions:

The XC6SLX150-3FGG900C device is a Spartan 6 LX FPGA-Field Programmable gate array IC. The Spartan-6 LX FPGA is optimized for applications that require the absolute lowest cost, support for up to 150K logical unit density, 4.8Mb memory, integrated memory controller, DSP slice, easy-to-use high-performance system IP, and innovative configurations based on open standards.


Benefits of Spartan-6 LX FPGA:

It meets the market requirements of low cost and large capacity applications

Advanced process technology and 6-input LUT architecture enable complex, high-performance functions at the most economical speed levels and in smaller devices

Rich logical resources and larger logical capacity (3.8K to 150K logical units) enable higher performance

One-of-a-kind, high-volume, low-cost FPGA with an integrated memory controller module that reduces costs by saving approximately 3,500 logic units per controller compared to soft solutions

Simplified configuration with support for low-cost third-party standards

Easy to use and high performance system IP

Fully environmentally friendly, RoHS compliant lead-free package

The total power consumption is greatly reduced

Effective use of 45nm low-power copper process technology

The 250 MHz DSP48A1 slice can reduce power consumption by as much as 50%

Low voltage device options to meet the most stringent power budgets

Advanced power management reduces static and dynamic power consumption

Provides flexible power-saving sleep and standby modes

Integrated memory controllers support low power memory standards

Mobile DDR and 1.3/1.5V DDR3


Specifications of XC6SLX150-3FGG900C:

Series: XC6SLX150

Number of logical elements: 147443 LE

Adaptive logic module - ALM: 23038 ALM

Embedded memory: 4.71 Mbit

Number of input/output terminals: 576 I/O

Supply voltage: 1.14V to 1.26V

Operating temperature: 0°C to + 85°C

Data rate: -

Number of transceivers: -

Installation style: SMD/SMT

Package/housing: FBGA-900

Brand name: AMD/Xilinx

Distributed RAM: 1355 kbit

Built-in block RAM-EBR: 4824 kbit

Maximum operating frequency: 1.08GHz

Humidity sensitivity: Yes

Number of logical array blocks -- LAB: 11519 LAB

Working power supply voltage: 1.2V

Product type: FPGA - Field Programmable Gate Array


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