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Shenzhen Mingjiada Electronics Co., Ltd. [Supply, Wanted TI] TDA4VM88TGBALFRQ1 TDA4VM-Q1 Automotive System-on-Chip for L2, L3 and Near Field Analysis Systems with Deep Learning

TDA4VM88TGBALFRQ1 Description:

The TDA4VM processor family is based on the evolving Jacinto™ 7 architecture for ADAS and autonomous vehicle (AV) applications and is built on TI's extensive market knowledge gained from more than a decade of advanced position in the ADAS processor market. The unique combination of high-performance computing, deep learning engines, and dedicated accelerators for signal and image processing in an architecture targeted at functional safety compliance makes the TDA4VM device ideally suited for a wide range of industrial applications such as: robotics, machine vision, radar, and more.

The TDA4VM provides high performance computing for both traditional and deep learning algorithms with an industry leading power/performance ratio and a high level of system integration, enabling scalability and lower cost for advanced automotive platforms supporting multiple sensor modes in centralised ECUs or standalone sensors. Key cores include next generation DSPs with scalar and vector cores, dedicated deep learning and legacy algorithm accelerators, the latest Arm and GPU processors for general purpose computing, integrated next generation imaging subsystems (ISPs), video codecs, Ethernet hubs and isolated MCU islands. All of this is protected by an automotive grade secure hardware accelerator.

Features

Processor cores:

- C7x floating-point vector DSP with performance up to 1.0GHz, 80GFLOPS, 256GOPS

- Deep learning matrix multiplication accelerator (MMA) with performance up to 8TOPS (8b) (at 1.0GHz)

- Vision processing accelerator (VPAC) with image signal processor (ISP) and multiple vision assist accelerators

- Depth and motion processing accelerator (DMPAC)

- Dual-core 64-bit Arm® Cortex®-A72 microprocessor subsystem with performance up to 2.0GHz

- 1MB L2 shared cache per dual-core Cortex®-A72 cluster

- 32KB L1 data cache and 48KB L1 instruction cache per Cortex®-A72 core

- Six Arm® Cortex®-R5F MCUs with performance up to 1.0GHz

- 16K instruction cache, 16K data cache, 64K L2 TCM

- Two Arm® Cortex®-R5F MCUs in isolated MCU subsystem

- Four Arm® Cortex®-R5F MCUs in the general computing partition

- Two C66x floating-point DSPs with performance up to 1.35GHz, 40GFLOPS, 160GOPS

- 3D GPU PowerVR® Rogue 8XE GE8430 with up to 750MHz, 96GFLOPS, 6Gpix/s performance

- Custom designed interconnect fabric supporting near maximum processing power

Applications

- Advanced surround view and parking assist systems

- Autonomous sensor fusion/awareness systems, including camera, radar and LIDAR sensors

- Single and multi-sensor front camera systems

- Next-generation electronic rear-view mirror systems

- Industrial mobile robots (AGV/AMR) with safety features

- Machine vision

- Intelligent retailing

- Smart shopping carts

- Construction and Agriculture

- Edge AI Boxes

- Single Board Computers

- Off-Highway Vehicle Control

- Industrial PCs with AI technology

Specific process for recycling:

1. You will simply sort your backlog of ICs/modules inventory, identifying the model, brand, date of manufacture, quantity, etc.

2. Please send the inventory list to our evaluation team by fax or email.

3. Wait for a purchase quote from our professionals and negotiate a specific transaction method for delivery after reaching an agreement.

4. The company only recycles regular sources, such as agents, traders, terminal factories, etc., and does not accept sources that are not regular channels.

The company's spirit: honest and trustworthy, professional and convenient, and customers to reach a win-win cooperation purposes welcome the majority of merchants call to discuss, if you have excess inventory needs to deal with, welcome to send the inventory list to: sales@hkmjd.com or call to discuss.

Contact Person: Mr. Chen/Valuation Team

Mobile number: +8613410018555

Company Home: www.hkmjd.com