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March 13 - Global DRAM giants such as Samsung Electronics and SK Hynix are accelerating the commercialization of 3D DRAM, but not nearly as much as Micron (which has been conducting 3D DRAM research since 2019 and has received two to three times as many patents as the two companies).

On the 12th, Korean semiconductor industry sources said that key semiconductor leaders from Samsung Electronics and SK Hynix recently told a semiconductor conference that they will accelerate the commercialisation of 3D DRAM, which they see as a way to overcome the physical limitations of DRAM.

3D DRAM is seen as a future growth driver for the semiconductor industry," said Lee Jong-myung, vice president of Samsung Electronics Semiconductor Research Institute and head of the Process Development Office at IEEE EDTM 2023, held at the Korea Trade Center in Samseong-dong, Gangnam-gu, Seoul. "

In addition, SK Hynix Vice President in charge of the SK Hynix Future Technology Research Institute also said, "Details of the electronic characteristics of 3D DRAM will be disclosed next year to determine the direction of development."

3D DRAM is a memory chip with a new structure. In simple terms, existing DRAM product development has focused on increasing density by reducing line widths, but as line widths move into the 10nm range, the industry is beginning to face physical limitations such as capacitor leakage and interference. To avoid or mitigate this effect, new materials and equipment such as high dielectric constant (high K) deposition materials and extreme ultraviolet (EUV) devices have been introduced. However, the semiconductor industry believes that manufacturing smaller chips at 10nm or more advanced chips will pose a significant challenge for manufacturers.

Samsung Electronics and SK Hynix have achieved mass production of high-end DRAM lines of 12nm in width this year. Given the current situation that DRAM line widths down to 1nm will face, the industry believes that the commercialisation of new DRAM will be a necessity rather than a direction in 3 to 4 years.

Of course, unlike the existing DRAM market, the 3D DRAM market is not yet known to have an absolute leader, so rapid volume production is critical. The industry is also starting to increase the demand for high-performance, high-capacity storage semiconductors as products for artificial intelligence applications such as ChatGPT become active.

We believe that as Samsung Electronics and SK Hynix begin to accelerate the commercialisation of 3D DRAM technology, we will see more vendors and even Chinese vendors launching similar technology solutions and products in the future, so stay tuned.

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