sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:EP4CGX110CF23C7N
Data Manual:EP4CGX110CF23C7N.pdf
Brand:Intel
Particular Year:23+
Package:484-FBGA
Delivery Date:New and Original
Stock: 1000pcs
EP4CGX110CF23C7N is based on a 1.5V, 0.13um, all-layer copper SRAM process, with densities up to 20,060 logic elements (LEs) and up to 288 Kbits of RAM.
Product Attributes
Number of LABs/CLBs: 4620
Number of Logic Elements/Cells: 73920
Total RAM Bits: 4257792
Number of I/O: 290
Voltage - Supply: 1.16V ~ 1.24V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FBGA (23x23)
Product Features
2,910 to 20,060 LEs
Up to 294,912 RAM bits (36,864 bytes)
Supports configuration through low-cost serial configuration device
Support for LVTTL, LVCMOS, SSTL-2, and SSTL-3 I/O standards
Support for 66 -MHz, 32-bit PCI standard
Low speed (311 Mbps) LVDS I/O support
Up to two PLLs per device provide clock multiplication and phase shifting
Up to eight global clock lines with six clock resources available per logic array block (LAB) row
Support for external memory, including DDR SDRAM (133 MHz),
FCRAM, and single data rate (SDR) SDRAM
Model
Brand
Package
Quantity
Describe
Xilinx
196-CSPBGA
1000
Spartan®-7 Field Programmable Gate Array (FPGA) IC,196-TFBGA, CSBGA
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Xeon Gold processors is optimized for demanding AI, mainstream data center, multi-cloud compute, and network and storage workloads. With support for higher memory speeds and enhanced memory capacity, these processors deliver advanced performance, ener…Contact Number:86-755-83294757
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