sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:Embedded - System On Chip (SoC)
Brand:Renesas
Particular Year:24+
Package:BGA-1022
Delivery Date:New and Original
Stock: 3000pcs
R8A779MBJXXXBA: R-Car H3Ne-1.7G High-End Automotive System-on-Chip (SoC) for In-Vehicle Infotainment Systems and Integrated Cockpits
Part Number: R8A779MBJXXXBA
Package: BGA-1022
Type: R-Car H3Ne-1.7G High-End Automotive System-on-Chip (SoC)
R8A779MBJXXXBA - Product Features:
CPU Core:
- Arm® Cortex®-A57 Quad-Core
- Arm® Cortex®-A53 Quad-Core
- Arm® Cortex®-R7 Dual Lockstep
External Memory:
- LPDDR4-SDRAM
- Maximum Operating Frequency: 1600MHz
- Data bus bandwidth: 32-bit x 2 channels (12.8GB/s x 2)
Expansion Bus: PCI Express 2.0 (1 lane) x 2 lanes
Memory Interface:
- USB 3.0 Host Interface (DRD) x 1 port (wPHY)
- USB 2.0 Host/Function/OTG Interface × 2 ports (wPHY)
- SD host interface × 4 channels (SDR104)
- Multimedia card interface × 2 channels
- Serial ATA interface × 1 channel
Package: BGA-1022 (29mm × 29mm, 0.8mm pitch)
Model
Brand
Package
Quantity
Describe
Microchip
TFBGA-325
2000
SmartFusion®2 SoC FPGA based on 166MHz Arm® Cortex®-M3 CPU
Microchip
TFBGA-325
2000
SmartFusion®2 SoC FPGA based on 166MHz Arm® Cortex®-M3 CPU
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Renesas Technology is one of the worlds top ten semiconductor chip suppliers, and has achieved the worlds highest market share in many fields such as mobile communications, automotive electronics, and PC/AV.Renesas Technology was formally established …
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E-mail:sales@hkmjd.com
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