sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:W66BM6NBUAGI
Data Manual:W66BM6NBUAGI.pdf
Brand:Winbond
Particular Year:23+
Package:WFBGA-200
Delivery Date:New original
Stock: 1000pcs
The W66BM6NBUAGI LPDDR4x comes in a single-chip package (SDP), offering 16MB X 16DQ X 8 memory bodies X 1 channel with a density of 2GB (2,147,483,648 bits). The LPDDR4x device uses a 2 or 4 clock architecture on the command/address (CA) bus to reduce the number of input pins in the system. The 6-bit CA bus contains command, address, and memory information.
Specifications
Product Category: Dynamic random access memory
Type: SDRAM-LPDDR4X
Installation style: SMD/SMT
Package/box: WFBGA-200
Data bus width: 16 bit
Organization: 128 M x 16
Storage capacity: 2 Gbit
Max clock frequency: 1.866 GHz
Power supply voltage - Max: 1.95V
Supply voltage - Minimum: 1.06V
Power current - Max. : 45 mA
Minimum operating temperature: -40 °C
Maximum operating temperature: + 95°C
Model
Brand
Package
Quantity
Describe
Kingston
FBGA-96
1000
Dynamic random access Memory Auto temp 4Gb 256Mx16 96 ball FBGA DDR3L 2133
Kingston
FBGA-96
2000
Dynamic random access Memory Auto temp 2Gb 128Mx16 96 ball FBGA DDR3L 2133
Kingston
FBGA-200
1000
Dynamic random access memory 16Gb 1024Mx16 200 ball LPDDR4 3733MHz
Kingston
FBGA-200
2000
Dynamic random access memory 32Gb 1024Mx32 200 ball LPDDR4x 4266MHz
Winbond
WFBGA-200
2000
SDRAM-Mobile LPDDR4 Memory IC 2Gb LVSTL_11 1.6GHz 3.6ns 200TFBGA
Winbond
VFBGA-96
2000
SDRAM-DDR3L memory IC 2Gb parallel 1.067GHz 20ns 96-VFBGA (7.5x13)
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