sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:W66CL2NQUAGI
Data Manual:W66CL2NQUAGI.pdf
Brand:Winbond
Particular Year:23+
Package:200-WFBGA
Delivery Date:New original
Stock: 1000pcs
The W66CL2NQUAGI LPDDR4 DRAM comes in a dual-chip package (DDP). The dual-chip package (DDP) offers 16MB X 16DQ X 8 memory bodies X 2 channels with a density of 4GB (4,294,967,296 bits). The LPDDR4 uses a 2 or 4 clock architecture on the command/address (CA) bus to reduce the number of input pins in the system.
Specifications
Memory type: volatile
Memory format: DRAM
Technology: SDRAM-Mobile LPDDR4
Storage capacity: 4Gb
Memory organization: 256M x 16
Memory interface: LVSTL_11
Clock frequency: 2.133GHz
Write cycle time - word, page: 18ns
Voltage - power supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating temperature: -40°C ~ 95°C (TC)
Mounting type: Surface mount type
Package/case: 200-WFBGA
Supplier Package: 200-WFBGA (10x14.5)
Basic product number: W66CL2
Model
Brand
Package
Quantity
Describe
Micron
78-FBGA
1000
SDRAM-DDR4 memory IC 16Gb in parallel 1.6GHz 19 ns 78-FBGA
Micron
78-FBGA
1000
SDRAM-DDR4 memory IC 16Gb parallel 1.5GHz 19 ns 78-FBGA (7.5x11)
Winbond
200-WFBGA
1000
SDRAM-Mobile LPDDR4 memory IC 2Gb LVSTL_11 1.866GHz 3.5ns 200WFBGA
Winbond
200-WFBGA
1000
SDRAM - Mobile LPDDR4X memory IC 2Gb LVSTL_11 1.6GHz 3.5ns 200WFBGA
Winbond
200-WFBGA
1000
SDRAM - Mobile LPDDR4X memory IC 4Gb LVSTL_11 2.133 GHz 3.5ns 200WFBGA
Winbond
178-VFBGA
1000
SDRAM-Mobile LPDDR3 Memory IC 1Gb HSUL_12 800 MHz 5.5ns 178VFBGA
Winbond
178-VFBGA
1000
SDRAM-Mobile LPDDR3 Memory IC 1Gb HSUL_12 800 MHz 5.5ns 178VFBGA
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