sales@hkmjd.com
Service Telephone:86-755-83294757
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Product Description:Ultra Low Power Bluetooth Audio SoC
Package:QFN-36Product Description:Ultra Low Power Bluetooth Audio SoC
Package:QFN-50Product Description:Ultra-Low Power, High Performance Smart Audio SoCs
Package:BGA-220Product Description:Ultra-Low Power, High Performance Smart Audio SoCs
Package:BGA-220Product Description:High Performance, Low Power Type-C Audio Chip
Package:BGA-48Product Description:High Performance, Low Power Type-C Audio Chip
Package:QFN-50Product Description:High Performance, Low Power Type-C Audio Chip
Package:FCCSP-134Product Description:The industry's first 12nm sports watch SoC platform
Package:BGAProduct Description:Highly integrated cost-effective Bluetooth audio SoC with dual-mode Bluetooth 5.3 support
Package:BGAProduct Description:Bluetooth audio SoC with Bluetooth 5.3 support
Package:BGAProduct Description:Highly integrated Bluetooth SoC with dual-mode Bluetooth 5.3 support
Package:BGAProduct Description:BES2600IHC series adopts dual-core Arm MCU and supports Bluetooth 5.3
Package:QFNProduct Description:Bluetooth audio SoC with Bluetooth 5.3 support
Package:QFNProduct Description:Ultra-low power Bluetooth audio SoC with Bluetooth 5.3 support
Package:BGAProduct Description:Ultra Low Power Bluetooth Audio SoCs
Package:BGAContact Number:86-755-83294757
Enterprise QQ:1668527835/ 2850151598/ 2850151584/ 2850151585
Business Hours:9:00-18:00
E-mail:sales@hkmjd.com
Company Address:Room1239, Guoli building, Zhenzhong Road, Futian District, Shenzhen, Guangdong
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