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On December 31, TSMC announced that the company held a 3-nanometer (3nm) volume production expansion ceremony at its new Fab 18 site in the Southern Taiwan Science Park (STSP).

TSMC said that the company has laid a solid foundation for 3nm technology and capacity expansion, with Fab 18 at STSP serving as the company's GIGAFAB ® facility for the production of 5nm and 3nm process technology. TSMC announced that 3nm technology has successfully entered volume production with good yields and held a topping out ceremony for its Fab 18 Phase 8 facility. TSMC estimates that 3nm technology will create $1.5 trillion in market value end products within a five-year volume production timeframe.

TSMC Fab 18 Phases 1 to 8 all have 58,000 square metres of clean room space, approximately twice the size of a standard logic wafer fab. TSMC's total investment in Fab 18 will exceed NT$1.86 trillion, creating more than 23,500 construction jobs and over 11,300 direct high-tech jobs. In addition to expanding 3nm capacity in Taiwan, TSMC is also building 3nm capacity in Arizona.

TSMC also announced that the company's global R&D centre in Hsinchu Science Park will officially open in the second quarter of 2023 and will be staffed with 8,000 R&D personnel. TSMC is also preparing its 2nm fabs, which will be located in the Hsinchu and Central Taiwan Science and Technology Parks, in a total of six phases as planned.

TSMC Chairman Dr Mark Liu presided over the 3nm volume expansion ceremony and said that TSMC continues to invest and prosper with the environment as it maintains its technology leadership while making significant investments in Taiwan. This 3nm volume expansion ceremony demonstrates that we are taking concrete actions to develop advanced technologies and expand capacity in Taiwan. Our goal is to grow with our upstream and downstream supply chains, develop future talent from design to manufacturing, packaging and testing, equipment and materials, provide the world with the most competitive advanced process technologies and reliable capacity, and drive future technological innovation.

TSMC is committed to co-prosperity with the natural environment through green manufacturing. TSMC's construction at STSP will all comply with Taiwan's EEWH and US LEED green building certification standards. The facilities will also utilise water from TSMC's STSP reclaimed water plant to gradually meet the company's target of using 60% reclaimed water by 2030. Once mass production begins, Fab 18 will use 20% Renewable energy to ultimately achieve the sustainability goal of 100% Renewable energy and zero emissions by 2050.

TSMC's 3nm process is the most advanced semiconductor technology in terms of power, performance, area (PPA) and transistor technology, and is a full node advancement from the 5nm generation. TSMC's 3nm process offers up to 1.6x logic density gain and 30-35 % power reduction at the same speed compared to the 5nm (N5) process, and supports TSMC's innovative FINFLEX ™ architecture.