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TSMC will hold a 3nm mass production and expansion ceremony at Tainan Science Park today to officially announce the launch of 3nm mass production. The ceremony will be attended by TSMC's Chairman and over 200 suppliers and partners. It is reported that TSMC's SCIP 18 is the production base for 5nm and 3nm, of which, SCIP 18 Phases 5 to 9 are the 3nm production base.

TSMC will start the new year with a capacity-limited N3 node process before moving to a more stable and efficient full production N3E later in 2023, followed by N3P in 2024, a year in which TSMC will also bring its 2nm GAA process into pilot production at its Hsinchu facility, with mass production to follow in 2025.

In previous quarterly earnings analyst calls, TSMC's CEO has stated that they are on track to advance the 3nm process to volume production in the second half of the year with respectable yields, and that production is expected to ramp up smoothly in 2023, driven by high performance computing and smartphone applications.

TSMC's website shows that their 3nm process is the next full generation process after 5nm, with the best PPA and transistor technology. Compared to the 5nm process, the 3nm process will offer approximately 70% more logic density, 10-15% faster at the same power consumption, or 25-30% lower power consumption at the same speed.

Samsung is understood to have started manufacturing 3nm semiconductors in June and is set to launch a more energy-efficient 3nm node in 2024. The company's chips will be used in Nvidia graphics cards, Qualcomm mobile processors, IBM CPUs and Baidu cloud server chips. Currently, Samsung is well behind TSMC in second place in terms of global semiconductor market share.