Welcome Here  Shenzhen Mingjiada Electronics Co., Ltd.

On November 25th, AMD recently launched the Ryzen 7 9800X3D, a new generation of high-end gaming processors with 3D Vertical Cache (3D V-Cache) technology added to the Zen 5 architecture, featuring 8 cores and 16 threads, with the L3 cache increased to 96MB from the 32MB of the regular model, and the total cache capacity increased to 104MB.The excellent gaming performance makes the Ryzen 7 9800X3D has become a hot product in the DIY market, even in the second-hand trading platforms need to be purchased at a premium.

According to Wccftech, AMD recently filed a new patent revealing plans to implement “multi-chip stacking” in future Ryzen SoCs, a novel package design that enables compact chip stacking and interconnections by partially overlapping chips. According to AMD, smaller chips are overlapped with larger chip sections to create space for other components and functions on the same chip.

The new approach is designed to improve the efficiency of the contact areas to make room for higher core counts, larger caches, and for increased memory bandwidth within the same chip size. The proposed stack will reduce the physical distance between components by overlapping small chips, minimizing interconnect latency and enabling faster communication between different chip sections. The design will also improve power management as the separated small chips allow better control of each cell through power gating.

The X3D family of processors, which introduced 3D V-Cache technology, has been a huge success in the consumer market, and with data center products leaving competitor Intel in the dust, it is expected that the new stacking approach will play an important role in future AMD EPYC/Ryzen products. Over the past few years, AMD has worked to move away from single chip designs and down the path of 3D chiplet. Due to the greater complexity of the design, there may be a longer wait to complete the process from patent to design, production and final product.