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SK Hynix Introduces World's First 16-High HBM3E Memory, Expected to Sample Early Next Year
SK Hynix CEO Rujung Kuo introduced the worlds first 16-High HBM3E memory at SK AI Summit 2024 in Seoul, South Korea today, 4 November. The product enables a single stack capacity of 48GB and is expected to sample early next year.Although it is general…
SK Hynix CEO Rujung Kuo introduced the world's first 16-High HBM3E memory at SK AI Summit 2024 in Seoul, South Korea today, 4 November. The product enables a single stack capacity of 48GB and is expected to sample early next year.
Although it is generally believed that 16-layer stacked HBM memory will not be officially commercialised until the next generation of HBM4, referring to an article by Rambus, an IP company in the memory field, HBM3E has the potential to be extended to 16 layers as well.
The paper prepared by SK Hynix for the IEEE ISSCC 2024 conference in February this year also mentioned a 48GB 16-High HBM3E DRAM with a bandwidth of 1280GB/s, and it is likely that the product launched this time will be the corresponding research and development result of the paper.
SK Hynix said that the AI training performance of its 16-High HBM3E is 18% higher than that of its predecessor's 12-High product, and the inference performance is 32% higher; this HBM memory still uses advanced MR-MUF (bulk reflow moulded underfill) bonding technology, and SK Hynix is also developing hybrid bonding with even better performance.
In the DRAM memory segment, SK Hynix said that in addition to the 16-High HBM3E, it is also developing LPCAMM2 based on 1c nm LPDDR5 and LPDDR6, which are aimed at both the PC and data centre markets.
In the NAND flash segment, the company is also preparing PCIe 6.0 SSDs, QLC-based high-capacity enterprise SSDs and next-generation UFS 5.0 flash.
Time:2024-11-16
Time:2024-11-16
Time:2024-11-16
Time:2024-11-16
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