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Molex has announced the launch of a new thermal management solution designed to address the growing demands of high-performance data center workloads such as generative AI and machine learning.

The solution not only reduces deployment and upgrade time, but also reduces costs. The Molex VaporConnect™ optical feedthrough module for two-phase immersion cooling features a unique modular load box design that is bolted directly to the immersion tank. Users can easily replace optical transceivers and network cabling infrastructure without changing mechanical interfaces or redesigning the housing structure to meet the ever-expanding computing speed and capacity demands of the data center. A reference design for the module is expected to be released in the first quarter of 2025.

Trevor Smith, General Manager of Optical Connectivity at Molex, said: "With innovative optical solutions, Molex is committed to simplifying the deployment and upgrading of data centres while effectively addressing key thermal management challenges. With VaporConnect, customers can easily replace modules, enable connectivity upgrades, and adjust the design of cooling systems, ensuring that the data center keeps pace with technological advances. This strategy not only speeds up upgrades, but also significantly reduces energy, cooling and technology costs and improves overall performance."

Simplified two-phase intrusive cooling

Molex's VaporConnect optical feedthrough module features a sealed design with full upgradeability that greatly simplifies the connection of the optical transceiver inside the immersion tank to the external cabling infrastructure. With VaporConnect, both the sealing and wiring processes are done inside the module, allowing users to easily upgrade the connector without changing the immersion tank design or structure. In addition, the design allows flexible reuse of standard cabling infrastructure across multiple product generations, effectively reducing the time, cost, and complexity required for deployment.

Molex offers single-mode and multimode fiber solutions that meet industry standards for different fiber connector sizes. These solutions have mix-and-match capabilities to enable system upgrades to higher performance or higher density connectors. Users can customize the module size according to the space and application requirements.

In addition, Molex's VaporConnect optical feedthrough module is available with FlexPlane™ technology to minimize external jumper and finishing requirements, seamlessly integrating complex fiber management and high-density cabling into the module, simplifying the installation process and enabling plug-and-play operation.

Multifunctional, upgradeable optical interconnection module

Each VaporConnect module is equipped with a fully tested sealing gasket that uses industry-standard helium leak detection methods to ensure a reliable seal between the gasket and the box wall. This design also ensures the smooth connection of the server line card from the slot to the external wiring system. Molex is currently conducting compliance tests against the industry standard GR-1435-CORE.

VaporConnect modules are designed to meet customer specifications, with the number of fibre channels depending on the number and type of connectors used. A single module can integrate up to 576 optical fibers. Molex offers a variety of sizing options, including MPO, LC, and high-density connector (VSFF) options such as MMC, MDC, SN, and SN-MT to accommodate existing infrastructure and simplify system upgrades. As part of Molex's ongoing investment in this area, the EBO connector option is currently under development and is expected to be launched in the first half of 2025.

This article is from: https://www.molex.com

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