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Paladin ® HD 112G Backplane Connector 146-D1D6-14V: Direct Female (RAF) 12-Pair 12-Column [Amphenol]

Paladin ® HD 112G Backplane Connector 146-D1D6-14V: Direct Female (RAF) 12-Pair 12-Column [Amphenol]

Source:our siteTime:2024-09-09Views:

Amphenols Paladin HD interconnect system has high density, supports 112GB/s data rate, provides high bandwidth, and supports up to 144 orthogonal differential pairs in 1U space. Paladin HD adopts balanced pair structure; High density transmission is a…

Amphenol's Paladin® HD interconnect system has high density, supports 112GB/s data rate, provides high bandwidth, and supports up to 144 orthogonal differential pairs in 1U space. Paladin HD adopts balanced pair structure; High density transmission is achieved with individually assembled and discretely shielded differential pairs, equipped with a subversive mixing board fixing mechanism. The mating interface is designed to optimize space and avoid traditional orthogonal "distortions". Multiple versions of the Paladin HD feature a common adapter interface that supports both orthogonal and cable applications.


Key features include:

Excellent bandwidth: 144 orthogonal differential pairs are supported in 1RU space and 112GB/s data rate is supported

Excellent transmission crosstalk performance

Equipped with a subversive hybrid board fixing mechanism to support flexible on-board wiring

1.5 mm connector, impedance control when pulled out

Discrete shielding and balanced differential pairs

Universal adapter interface


Product: 146-D1D6-14V

Series: Paladin® HD 112G

Type: Right Angle Female (RAF)

Data rate: 112Gb/s

Total difference pair: 144

Impedance: 92 ohms


Features and advantages:

Excellent orthogonal density

144 differential pairs are supported in 1RU card space to ensure air circulation

Industry-standard performance for 112G systems

The XTalk margin at 25GHz when factoring in insertion loss (IL) exceeds 40dB

Linear transmission bandwidth of more than 40GHz

No stump resonance at 40GHz

Hybrid plate holding mechanism with crimp ground terminal and crimp signal supports traditional manufacturing process

The wiring is optimized for the maximum line difference pair density, signal integrity and difference of the top layer of the board

More wiring channels can be accommodated to minimize the number of layers

It supports 144 orthogonal difference pairs and can be wired in 6 high-speed layers with up to 2 difference pairs per layer

Maintain consistent signal integrity across the mechanical mating range of the connector

When the unplugged connector length reaches 1.5 mm, the impedance change is less than 5 ohms

Each difference uses mechanical matching and electrical balancing signals internally

Low time delay design supports low mode conversion and traditional routing

Universal symmetrical mating interface

Supports 90°/270° orthogonal applications, as well as male and female cables

Utilize the mature Paladin differential pair architecture and adapter interface

Optimized reliability, robustness, and quality to support real-world 112G applications

92Ω (+/- 5Ω) nominal impedance

Future upgrades are being designed


Applications:

Communication equipment

Data center


Paladin® HD 112G Backplane series:

146-D1D6-14V

147-415C-24V

147-415E-24V

147-415G-24V

147-415J-24V

147-415L-24V

147-615C-24V

147-615E-24V

147-615G-24V

147-615J-24V

147-615L-24V

147-815C-24V

147-815E-24V

147-815G-24V

147-815J-24V

147-815L-24V

147-D15E-24V

147-D15G-24V

147-D15J-24V

147-D15L-24V


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Email: sales@hkmjd.com

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