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Supply High Speed Board-to-Board Connectors LP Array ™ (LPAF-40-03.0-S-08-2-K-TR) High Density Array

Supply High Speed Board-to-Board Connectors LP Array ™ (LPAF-40-03.0-S-08-2-K-TR) High Density Array

Source:our siteTime:2024-09-03Views:

The LPAF-40-03.0-S-08-2-K-TR is a 320 position, 1.27mm LP Array™ high speed high density light thin terminal open terminal array with socket connectors.Product: LPAF-40-03.0-S-08-2-K-TRConnector type: socketNeedle number: 320Spacing: 1.27mmNumber of …

The LPAF-40-03.0-S-08-2-K-TR is a 320 position, 1.27mm LP Array™ high speed high density light thin terminal open terminal array with socket connectors.

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Product: LPAF-40-03.0-S-08-2-K-TR

Connector type: socket

Needle number: 320

Spacing: 1.27mm

Number of rows: 8

Mounting type: Surface mount type

Contact surface treatment: gold plating

Contact surface treatment thickness: 30.0µin (0.76µm)

Joint stack height: 4mm, 4.5mm

Board height: 2.79mm


Overview:

LP ARRAY™ Light Thin Terminals The Open terminal high density array uses a double beam terminal system and 1.27 mm x 1.27 mm (.050" X.050 ") pitch grid for the highest ground and wiring flexibility. The system offers 4 mm, 4.5 mm and 5 mm butt heights and a total of up to 400 terminals in 4, 6 or 8 row configurations.


This family of products supports 56 Gbps PAM4 applications and is certified Final Inch® for shunt area line routing recommendations, saving designers time and money. Standard lead-free solder crimping simplifies infrared reflow end bonding and improves solder joint reliability.


LPAF connector features:

• Analog Over Array™ capability

• Lightweight type 4 mm, 4.5 mm, 5 mm stack height

• Up to 400 I/O ports

• 4, 6 and 8 row designs

• 050" (1.27 mm) spacing

• Double beam terminal system

• Welding and crimping pins, easy to process

• 56 Gbps PAM4 performance


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