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Supply High Speed Board-to-Board Connectors LP Array ™ (LPAF-40-03.0-S-08-2-K-TR) High Density Array
The LPAF-40-03.0-S-08-2-K-TR is a 320 position, 1.27mm LP Array™ high speed high density light thin terminal open terminal array with socket connectors.Product: LPAF-40-03.0-S-08-2-K-TRConnector type: socketNeedle number: 320Spacing: 1.27mmNumber of …
The LPAF-40-03.0-S-08-2-K-TR is a 320 position, 1.27mm LP Array™ high speed high density light thin terminal open terminal array with socket connectors.
Product: LPAF-40-03.0-S-08-2-K-TR
Connector type: socket
Needle number: 320
Spacing: 1.27mm
Number of rows: 8
Mounting type: Surface mount type
Contact surface treatment: gold plating
Contact surface treatment thickness: 30.0µin (0.76µm)
Joint stack height: 4mm, 4.5mm
Board height: 2.79mm
Overview:
LP ARRAY™ Light Thin Terminals The Open terminal high density array uses a double beam terminal system and 1.27 mm x 1.27 mm (.050" X.050 ") pitch grid for the highest ground and wiring flexibility. The system offers 4 mm, 4.5 mm and 5 mm butt heights and a total of up to 400 terminals in 4, 6 or 8 row configurations.
This family of products supports 56 Gbps PAM4 applications and is certified Final Inch® for shunt area line routing recommendations, saving designers time and money. Standard lead-free solder crimping simplifies infrared reflow end bonding and improves solder joint reliability.
LPAF connector features:
• Analog Over Array™ capability
• Lightweight type 4 mm, 4.5 mm, 5 mm stack height
• Up to 400 I/O ports
• 4, 6 and 8 row designs
• 050" (1.27 mm) spacing
• Double beam terminal system
• Welding and crimping pins, easy to process
• 56 Gbps PAM4 performance
Time:2024-11-18
Time:2024-11-18
Time:2024-11-18
Time:2024-11-18
Contact Number:86-755-83294757
Enterprise QQ:1668527835/ 2850151598/ 2850151584/ 2850151585
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E-mail:sales@hkmjd.com
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