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Supply and demand Kingston B3 221XM3BD GVI-U: SDRAM memory 32Gb 1024Mx32 200 ball LPDDR4x 4266MHz

Supply and demand Kingston B3 221XM3BD GVI-U: SDRAM memory 32Gb 1024Mx32 200 ball LPDDR4x 4266MHz

Source:our siteTime:2024-09-02Views:

The B3221XM3BDGVI-U is a dynamic random access memory 32Gb 1024Mx32 200 ball LPDDR4x 4266MHz.Product: B3221XM3BDGVI-UType: SDRAM-LPDDR4Storage capacity: 16 GbitData bus width: 16 bitMax clock frequency: 2.133GHzPackage/housing: FBGA-200Organization: 1…

The B3221XM3BDGVI-U is a dynamic random access memory 32Gb 1024Mx32 200 ball LPDDR4x 4266MHz.

B3221XM3BDGVI-U_副本.jpg

Product: B3221XM3BDGVI-U

Type: SDRAM-LPDDR4

Storage capacity: 16 Gbit

Data bus width: 16 bit

Max clock frequency: 2.133GHz

Package/housing: FBGA-200

Organization: 1 G x 16

Access time: 3.5 ns

Supply voltage - Minimum: 1.06V

Power supply voltage - Max: 1.95V

Operating temperature: -25°C ~ 85°C


Overview:

The Kingston LPDDR4X combines energy efficiency, high performance and compact form factor, making it an excellent choice for mobile devices. LPDDR4X is the first choice for mobile devices that focus on energy efficiency and performance. Usage of the device continues to grow in a wide range of applications and end products. Kingston's LPDDR4x DRAM components are compatible with most SoC chipsets. Kingston's LPDDR4 DRAM components have a commercial operating temperature range of 0°C to +70°C and an industrial operating temperature range of -40°C to +85°C.


Features:

Low power consumption

Refresh one storage body by one

Partial array self-refresh (PASR), storage body mask, and segment mask

Automatic temperature compensation self-refresh (ATCSR) with built-in temperature sensor

Supports automatic refresh for all storage units and targeted automatic refresh for each storage unit

Double data rate architecture: two data transfers per clock cycle

Differential clock inputs (CK_t and CK_c)

Bidirectional differential data strobes: DQS_t and DQS_c

Commands are entered at the rising and falling edges of CK_t; The data and data mask refer to the edge of DQS_t

DMI pins support writing data masks and DBIdc functionality

Commercial temperature range: 0°C to +70°C

Industrial operating temperature range: -40°C to +85°C


Applications:

Mobile device

Handheld device

Smartphones and tablets

Wearable technology

Automotive system

Consumer electronics


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