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As the overall supply of NAND flash memory device controllers is limited, memory chip suppliers have turned to sourcing from flash memory device controller manufacturers, including Samsung, Micron and other NAND flash memory chip suppliers that have increased demand for more controller chip production to third Third-party suppliers place orders, such as Phison and Huirong Technology.

Phison expects the supply of flash device controllers, especially those based on the 55nm process, to remain tight until 2023, citing sources, and estimates that the supply gap for 55nm chips is about 40%. This has forced flash device controller suppliers to phase out production of older generation USB and SD 2.0 devices and necessarily prioritise their 3.0 chip supply to specific partners for profit reasons.

As strong demand for automotive chips, CIS sensors, and OLED display driver chips occupies the additional 28nm capacity of foundries, Huirong Technology expects that the supply of 28nm chips will remain tight through 2023.

On the other hand, the shortage of SSD control ICs is expected to continue into 2022 due to tight upstream logic IC wafer capacity and shortage of ABF substrates used in BGA packaging. Judging from the control IC required for large-capacity SSDs, whether the shortage can be alleviated depends on the situation in the third quarter.

Relevant companies said that the growth of batch SSD module packaging and testing business is expected to rebound significantly in the second half of 2022, and the shortage of control ICs is expected to ease in the third quarter. Memory packaging and testing plants are also actively seeking more ABF capacity and control IC suppliers, hoping that the SSD packaging and testing business will grow in the second half of 2022.