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Recycle ST BLE Application Processors:BLE Wireless MCU,Multi-Protocol Wireless MCU,BLE Module

Recycle ST BLE Application Processors:BLE Wireless MCU,Multi-Protocol Wireless MCU,BLE Module

Source:our siteTime:2025-08-13Views:

Recycle ST BLE Application Processors:BLE Wireless MCU,Multi-Protocol Wireless MCU,BLE ModuleShenzhen Mingjiada Electronics Co., Ltd. is an experienced and well-established electronic component recycler with a strong team, dedicated to helping custome…

Recycle ST BLE Application Processors:BLE Wireless MCU,Multi-Protocol Wireless MCU,BLE Module


Shenzhen Mingjiada Electronics Co., Ltd. is an experienced and well-established electronic component recycler with a strong team, dedicated to helping customers reduce inventory, minimise storage space, and lower storage and management costs. We specialise in recycling high-end electronic chips, providing customers with high-quality recycling services. Additionally, we closely monitor the latest trends and technological advancements in electronic products to ensure our recycling services remain aligned with market demands.


We specialise in the long-term recycling of 5G chips, new energy ICs, IoT ICs, Bluetooth ICs, vehicle networking ICs, automotive-grade ICs, communication ICs, artificial intelligence ICs, memory ICs, sensor ICs, microcontroller ICs, transceiver ICs, Ethernet ICs, WiFi chips, wireless communication modules, connectors, and more.


Recycling Process:  

1. Consultation: If you have inventory electronic components that need to be disposed of, you can send an email listing the ICs/modules you wish to sell.

2. On-site Recycling: Our company will dispatch professional staff to collect your inventory electronic components on-site and conduct preliminary testing and classification of the components.  

3. Quotation: The company will provide a corresponding recycling price based on factors such as the type, quantity, and quality of the recycled components.  

4. Settlement: Once both parties reach an agreement, specific transaction methods for delivery can be negotiated.


【Bluetooth® LE: a must-have in today’s connected products】

If you need to add Bluetooth® LE connectivity to your product, this is where we come in. ST’s portfolio of single-chip solutions is the most comprehensive in the market, with best-in-class hardware resources, ecosystem, and power optimization. Our products can efficiently enable any application from beaconing to multiprotocol communication required for Matter devices, or localization and audio based on Bluetooth® LE technology.


ST Bluetooth® LE microcontrollers range from the STM32WB0 series of MCUs, tailored for entry-level and cost-sensitive applications, to the STM32WB and STM32WBA series, offering the best level of performance and applicative flexibility.


Being part of the market-leading ST family of MCUs, our Bluetooth® LE products all come with ST’s state-of-the-art MCU ecosystem and renowned free technical support to accompany you during your design process.


【Bluetooth® LE wireless MCUs】

Our most affordable wireless MCUs, the STM32WB0x and BlueNRG, are designed for efficient and quality Bluetooth® LE integration in cost-sensitive applications. With +8dBm output power and support for Bluetooth® LE features like long-range mode, 2 Mbps transfers, and advanced connectivity options, they offer the right balance between affordability and performance.


The STM32WB15, powered by Arm® Cortex®-M4 and Cortex®-M0+ cores, are comprehensive Bluetooth® LE SoCs with a 2 Mbps data rate and extensive peripheral integration. They provide a robust, standalone solution for a variety of applications.


For enhanced security, the STM32WBA50, STM32WBA52, and STM32WBA62 feature the Arm® Cortex®-M33 core with TrustZone® technology, ensuring data protection and resistance to hacking. These products excel in Bluetooth® LE applications and offer advanced features.


【Multi-protocol wireless MCUs】

Dual-core and single-core multiprotocol wireless microcontrollers support Bluetooth® LE, Zigbee®, Thread®, Matter®, and proprietary connectivity technologies.


Multiprotocol capability benefits from exclusive/static connectivity use over time, allowing time-sharing between different technologies depending on the final application requirements.


The STM32WB35/55, STM32WBA54/55, and STM32WBA64/65 feature are suitable for applications that require support for multiple protocols.


【Bluetooth® LE modules】

Equipped with an on-board antenna, crystal oscillator and all necessary passives, ST’s Bluetooth® LE modules offer a proven, robust solution that ensures a quick time-to-market. They come with the certified Bluetooth Qualification Expert (BQE) solution, as well as major regional EMC regulations like CE, FCCID, thus ensuring rapid integration into the final application and providing an easy-to-use solution.


Our Bluetooth® LE ICs and modules are supported by an extensive set of evaluation boards, software development kits, application notes and design guidelines – thus facilitating the adoption of Bluetooth wireless connectivity technology into a wide variety of applications.


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