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Kioxia Corporation, a global leader in storage solutions, announced today that it has begun providing samples of the new universal Flash Storage (UFS) version 4.1 embedded storage devices for automotive applications. These new devices are specifically designed to meet the demanding requirements of the next-generation in-vehicle systems. With Kioxia's 8th generation BiCS FLASH™ 3D flash memory and self-developed controller technology, they have achieved significant improvements in performance, flexibility and diagnostic functions.

The new UFS 4.1 device offers multiple capacity options including 128GB, 256GB, 512GB and 1TB, aiming to meet the demands of scenarios such as infotainment systems, advanced driver assistance systems (ADAS), in-vehicle telematics, domain controllers and in-vehicle computers. The product complies with the AEC-Q100/104 Grade 2 standard and supports a maximum housing temperature of 115°C.

Compared with Kioxia's UFS 3.1 generation product, the performance improvement of the new UFS 4.1 (512GB) device is as follows:

The continuous reading performance has been improved by approximately 2.1 times

The continuous write performance has been improved by approximately 2.5 times

The random read performance has been improved by approximately 2.1 times

The random write performance has been improved by approximately 3.7 times

These improvements will bring a smoother user experience to data-intensive in-vehicle environments.

Core features include:

Compliant with UFS 4.1 specifications, it includes extended functions related to WriteBooster (such as WriteBooster buffer adjustment and fixed part refresh mode), providing greater flexibility for optimizing performance. UFS 4.1 is backward compatible with UFS 4.0 and UFS 3.1.

Enhanced diagnostic capabilities, with the addition of vendor-specific device health descriptors, simplify device status monitoring and predictive maintenance.

• Adopt the 8th generation BiCS FLASH™ 3D flash memory.

Kioxia's UFS 4.1 device integrates the company's innovative BiCS FLASH™ 3D flash memory and controller in the JEDEC standard package. These brand-new UFS devices are built with Kioxia's 8th generation BiCS FLASH™ 3D flash memory. This generation of products introduced CBA (CMOS Direct Bonding to Array) technology - an architectural innovation marking a major leap in flash memory design. By directly bonding CMOS circuits to memory arrays, CBA technology has significantly enhanced energy efficiency, performance and storage density.