Welcome Here  Shenzhen Mingjiada Electronics Co., Ltd.

Kioxia Corporation has expanded its high-capacity KIOXIA LC9 series enterprise SSD product line by launching the industry's first 245.76 terabyte (TB)NVMe™ SSD, available in two specifications: 2.5-inch and EDSFF E3.L. This new capacity and specification option complements the previously released 122.88TB (2.5-inch) model and is specifically designed to meet the performance and efficiency requirements of generative AI environments.

Generative AI has unique storage requirements, including the need to store massive datasets for training large language models (LLMS), as well as create embedding vector and vector databases to support inference achieved through retrieval enhancement generation (RAG). These workloads require storage solutions with outstanding capacity, speed and efficiency.

The KIOXIA LC9 series SSD adopts 32-layer stacked 2-terabit (Tb) BiCS FLASH™ QLC 3D flash memory and combines the innovative CBA (CMOS Direct Bonding to Array) technology, which can provide the speed, scale and density needed to support the next wave of data center workloads. This advanced storage architecture, combined with CBA technology, has achieved a capacity of 8 TB in a 154-ball grid array (BGA) small package - this is also an industry first. The realization of this milestone is attributed to Kioxia's high-precision wafer processing, material design and wire bonding technology.

The KIOXIA LC9 series SSD is highly suitable for data lake scenarios, where large-scale data intake and rapid processing are of crucial importance. Unlike hard disk drives (HDDS), which often become performance bottlenecks and lead to underutilization of expensive Gpus, the KIOXIA LC9 series SSDS can achieve high-density storage in a compact space and have a higher capacity per watt. With a capacity of up to 245.76TB, they can replace multiple high-power HDDS, offering superior performance, lower overall power consumption, occupying fewer drive slots, and achieving more efficient cooling. These features help to reduce the total cost of ownership (TCO) in terms of power consumption, density and thermal management.

The features of the KIOXIA LC9 series SSD include:

The SSD has a capacity of up to 245.76TB and is available in two specifications: 2.5-inch and E3.L

The E3.S specification has a capacity of up to 122.88TB

The design complies with the PCIe® 5.0 standard (up to 128 GT/s Gen5 single x4, dual x2)

Supports NVMe™ 2.0 and NVME-MI ™ 1.2c specifications

Support the NVMe™ SSD 2.5 specification for Open Computing Project (OCP) data centers (not all requirements)

Supports flexible Data Placement (FDP) functionality to minimize write amplification and extend the lifespan of SSDS

Security options: Supports SIE, SED, FIPS SED

The CNSA 2.0 signature algorithm is adopted, and the future quantum security standards are taken into consideration during the design

The KIOXIA LC9 series SSD has now begun to provide samples to some customers and will be exhibited at the Future of Memory and Storage 2025 conference to be held in Santa Clara from August 5th to 7th.

For more news and information, visit www.hkmjd.com.