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Nexperia recently announced the expansion of its bipolar transistor (BJT) product portfolio, launching 12 MJD-style bipolar transistors in copper wafer packaging (CFP15B). This new product, named the MJPE series, is designed to meet the continuous demand in the industrial and automotive sectors for higher power efficiency and more cost-effective design solutions. Compared with the traditional DPAK packaged MJD transistors, the MJPE series products in CFP15B packaging can significantly save circuit board space and bring cost advantages while ensuring that performance is not affected.

This new product series includes 6 automotive-grade products (such as MJPE31C-Q) and 6 industrial-grade products (such as MJPE44H11), with VCEO ratings of 50V, 80V and 100V, and collector currents (IC) of 2A, 3A and 8A. Both NPN and PNP models are available. These BJTS further enrich Nexperia's extensive CFP product portfolio, which already covers a variety of Schottky diodes and recovery rectification power diodes. This move is another measure to promote the standardization of package sizes for multiple product categories, which will help simplify PCB design and optimize the supply chain.

The CFP15B packaged BJT has a wide range of applications, including battery management system (BMS) power supplies, electric vehicle (EV) on-board chargers, and video display backlight drivers, etc. Its thermal performance is comparable to that of traditional products (automotive-grade products can operate in an environment as high as 175℃), but the soldering area is reduced by 53%. In addition, the copper clamp technology of CFP15B packaging not only endows the device with excellent mechanical stability, but also enhances its electrical and thermal performance.

Frank Matschullat, the product group manager of Nexperia's power bipolar discrete devices, said: "With the increasing popularity of high-performance microcontrollers, the industry is shifting towards multi-layer printed circuit boards, and packaging has thus become a key part of the cooling system." Modern CFP packaging technology is specifically designed for multi-layer PCBS, capable of achieving the same electrical performance at a significantly reduced size, which helps to lower the cost of devices and the overall system. The market demand for CFP packaging products is constantly increasing, and such products are crucial for the forward-looking development of automotive and industrial applications. To meet this demand, Nexperia has significantly increased its production capacity in various aspects, including the MJPE series BJT.

For more information about Nexperia 's bipolar transistor portfolio, please visit: nexperia.cn/MJPE

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