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Recycle Amphenol Board to Board Connectors:BergStak,XCede HD,Crossbow™,VHDM

Shenzhen Mingjiada Electronics Co., Ltd. is a professional company specialising in the recycling of electronic components, offering global inventory recycling services covering a wide range of product categories, including integrated circuits (ICs), 5G chips, new energy ICs, IoT chips, Bluetooth chips, automotive chips, AI ICs, Ethernet ICs, memory chips, sensors, IGBT modules, and more.

Core Advantages:

High-Priced Recycling: Based on real-time global market trends, we offer quotes above the market average price, with particularly higher premiums for scarce models.

Quick Payment: We commit to completing inspection and payment within 48 hours, supporting multi-currency settlement.

Global Logistics: Leveraging warehousing centres in Shenzhen, Hong Kong, North America, and Europe, we provide global logistics support via DHL, UPS, SF Express, and other carriers.

Service Process:  

Online Submission of Inventory List: Customers provide model numbers, quantities, batch information, etc.  

Free Evaluation and Quotation: Feedback on inspection plans and estimated values within 24 hours.  

Secure Logistics Handling: Supports cash-on-delivery logistics and fully insured transportation throughout the process.  

Payment Upon Inspection: Completion of inspection and payment within 48 hours of arrival.  

【BergStak® 0.40mm Connector】

The BergStak® 0.40mm board-to-board connectors are in 0.4mm pitch with double row contacts, the family now supports stack height of 1.50/2.0/3.0/3.5/4.0mm and position ranges in 10-100 positions (10/20/24/30/34/40/50/60/70/80/90/100). The lock feature on contacts works together with shock-absorbing ribs on the housing to make it suitable for high-vibration applications and friendly for FPC applications. Its high-speed performance makes it a good candidate for HS applications.

Fine pitch of 0.4 mm with a wide range of heights: 1.50/2.0/3.0/3.5/4.0mm stack heights, supporting 10 to 100 positions

The lock feature on the contact area provides higher reliability

USCAR-2 V2 qualified

High-speed performance: 16Gb/s (PCIe®/USB)

Self-alignment feature to support FPC-to-Board applications

【XCede® HD】

XCede® HD product leverages the same core technologies as standard XCede® series. Providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical.

XCede® HD product family includes XCede® HD, XCede® HD Plus and XCede® HD2 supporting various data rate up to 56Gb/s with backward compatibility.

XCede® HD backplane connector is designed with data rate up to 20 Gb/s in a Hard Metric form factor. XCede® HD Plus backplane connector achieves higher performance (up to 28+ Gb/s) and XCede® HD2 has upgraded the performance to 56Gb/s.

Differential pairs 28-84 per inch (11-33 differential pairs per cm)

Supports backplane, co-planar, and midplane configurations

Supports 85Ω and 100Ω impedance

3-, 4-, 6-Pair configurations

Modular construction with integrated power and guidance options

Compliance with the Hard Metric form factor requirements outlined in EN 61076-4-101:2001

【Crossbow™】

Crossbow allows designers to take advantage of all the benefits associated with orthogonal mid-plane architectures as the differential pairs on each side of the mid-plane share vias creating a straight pass-through connection. This shared via approach combined with the Crossbow footprint, eliminates most electrical problems associated with the typical backplane via stub.

In addition to the electrical benefits, the connector provides the overall lowest cost solution by eliminating the need to route high-speed traces across the backplane to connector from the front to back. This can help to reduce PCB layers by up to 50%.

Crossbow was designed with features allowing the connector to meet the most rigorous mechanical requirements. The contacts are protected with end walls that are higher than the signal blades. In addition to the contact protection, the signal blades are designed to be very rigid utilizing thicker gauges, strengthening ribs and high performance copper alloy.

【VHDM®】

Amphenol's VHDM® connector's modular format and breadth of components provides unmatched design flexibility. VHDM® can be combined with VHDM-HSD™ to incorporate both single-ended and differential signaling within the same connector.

VHDM® derivatives provide an upgrade path to 25 Gb/s with backward mate compatibility to allow for scale as needed.

With 20+ years in the market and billions of pins installed worldwide, VHDM® continues to be a connector of choice for customers requiring proven performance, design flexibility, durability and reliability.