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On 4 June, Broadcom announced that it has begun shipping the Tomahawk 6 switch series chips, which offer 102.4 Tbps of switching capacity on a single chip—twice the bandwidth of current Ethernet switches on the market.

According to Broadcom's announcement, the Tomahawk 6 is designed for next-generation scalable and AI-optimised networks, offering unprecedented scalability, energy efficiency, and AI-optimised features. It provides greater flexibility by supporting 100G/200G SerDes and co-packaged optical modules (CPO). It offers the industry's most comprehensive AI routing capabilities and interconnect options, aimed at meeting the needs of AI clusters with over one million XPUs.

‘AI clusters are scaling from tens to thousands of accelerators, with the network becoming a critical bottleneck, while also expected to deliver unprecedented bandwidth and latency,’ said Kunjan Sobhani, Chief Semiconductor Analyst at Bloomberg Intelligence. ‘By breaking the 100Tbps barrier and unifying scalable and extensible Ethernet, Broadcom's Tomahawk 6 provides hyperscale enterprises with an open, standards-based fabric — free from proprietary lock-in — and a clear, flexible path to the next wave of AI infrastructure.’

The Tomahawk 6 series includes a breakthrough option: single-chip support for 1,024 100G SerDes, enabling customers to deploy AI clusters with extended copper distances and efficiently utilise XPUs and optical devices with native 100G interfaces.

For systems requiring optical connectivity, Tomahawk 6 will also offer co-packaged optical options, delivering the lowest power consumption and latency while reducing link jitter and enhancing long-term reliability. The Tomahawk 6 CPO solution builds on the technology delivered by Broadcom's previous CPO versions through Tomahawk 4 and 5.