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Supply Altera Agilex™ SoC FPGA Series Product:Agilex™ 9,Agilex™ 7,Agilex™ 5,Agilex™ 3
Supply Altera Agilex™ SoC FPGA Series Product:Agilex™ 9,Agilex™ 7,Agilex™ 5,Agilex™ 3Shenzhen Mingjiada Electronics Co., Ltd. is a professional electronic components supplier. We specialise in all kinds of electronic components such as IC ICs, 5G…
Supply Altera Agilex™ SoC FPGA Series Product:Agilex™ 9,Agilex™ 7,Agilex™ 5,Agilex™ 3
Shenzhen Mingjiada Electronics Co., Ltd. is a professional electronic components supplier. We specialise in all kinds of electronic components such as IC ICs, 5G chips, new energy ICs, IoT chips, Bluetooth chips, automotive chips, AI ICs, Ethernet ICs, memory chips, sensors, IGBT modules and so on. With extensive procurement channels and rich supply experience, we provide customers with stable and reliable original electronic component products.
Agilex™ SoC FPGA Series Overview
The Agilex™ SoC FPGA family represents the forefront of FPGA technology and is the flagship programmable logic platform for the future of intelligent computing. With innovative technologies such as heterogeneous integrated architecture, ultra-low-power design, and advanced process nodes, the series achieves leapfrog breakthroughs in performance, flexibility, and power-efficiency ratios, making it the solution of choice for data centre acceleration, 5G communications, industrial automation, and autonomous driving.
The Agilex™ series uses an innovative chip heterogeneous integration technology (Chiplet design) to integrate FPGA programmable logic units, hardcore processor systems (e.g., Arm Cortex) and dedicated acceleration modules (e.g., AI Tensor blocks) through advanced packaging technology. This design not only increases performance density, but also dramatically reduces power consumption while maintaining the inherent reconfigurable flexibility of FPGAs.
Agilex™ 9 Series: Heterogeneous Computing Platform for Ultimate Performance
The Agilex™ 9 Series is the top-performance representative of the Agilex™ family, designed for the most demanding high-performance computing (HPC), AI training and inference, and hyperscale data centre acceleration. The family features Intel's most advanced process technologies and packaging innovations to deliver unrivalled compute density and power efficiency.
Technical Feature Highlights:
3D Heterogeneous Integration: Agilex™ 9 uses innovative 3D packaging technology to vertically integrate high-performance FPGA logic chips, HBM2E high-bandwidth memory stacks, and dedicated accelerator chips for ultra-short interconnect distances and very high bandwidth.
Extreme Computing Performance: Integrates up to millions of logic elements (LEs), supports PCIe 5.0/CXL 2.0 interfaces, and delivers transceiver speeds up to 112Gbps to meet the extreme arithmetic demands of AI model training/reasoning.
Memory subsystem innovation: Supports up to 32GB of HBM2E memory, delivering more than 820GB/s of peak memory bandwidth, while the integrated DDR5 controller supports up to 179GB/s of additional memory bandwidth
AI Acceleration Optimisation: Built-in dedicated AI Tensor block supports multiple precision fixed-point (INT4/INT8) and floating-point (FP16/BF16) operations, dramatically improving the efficiency of deep learning workloads7
Application Scenarios:
The Agilex™ 9 series is particularly suited to application scenarios that require ultra-high compute throughput and very low latency:
Data centre AI acceleration: large-scale language model (e.g. Llama3) training and inference, recommendation system acceleration
High-performance computing: financial risk modelling, climate simulation, gene sequencing and other scientific computations.
Ultra HD video processing: 8K/16K video real-time encoding and processing, broadcast-quality video production
Advanced network equipment: 400G/800G Ethernet switching, next-generation firewall and network security equipment7
Agilex™ 7 Series: The Mainstream Choice for Balancing Performance and Energy Efficiency
The Agilex™ 7 Series is the workhorse of the Agilex™ product line, striking an excellent balance between performance, power consumption and cost for a wide range of applications such as 5G communications, industrial automation, automotive electronics and edge computing. The series is further subdivided into three sub-series, F-Series (high bandwidth), I-Series (low power), and M-Series (memory-optimised), to meet the specific needs of different application scenarios.
Series differentiation:
F-Series: Focusing on high-bandwidth applications, it provides transceiver rates up to 58Gbps, supports PCIe 5.0 and CXL protocols, and is suitable for 5G base station pre-transmission/mid-transmission and high-speed network equipment.
I-Series: Optimised for low-power design with 10nm SuperFin process for power-sensitive applications such as edge AI devices and portable medical devices
M-Series: Memory bandwidth optimised with integrated HBM2E and DDR5/LPDDR5 controllers, providing up to 1TB/s of aggregated memory bandwidth, designed for AI inference and data processing intensive applications
Core Technology Advantage:
Second-generation Hyperflex architecture: provides ~2x performance-to-power ratio improvement over competitors' 7nm FPGAs
Hardcore Processor Integration: Some models integrate Arm-based processor subsystems for hardware and software co-design.
Advanced DSP block: Supports fixed-point and floating-point operations with a wide range of precision to meet the needs of complex algorithms such as radar signal processing and medical imaging.
Security Enhancement: Provides high-performance encryption block and secure boot function, complying with industrial and automotive functional safety standards.
Typical application cases:
5G communications: base station signal processing (beamforming, massive MIMO), pre-transmission/mid-transmission network protocol conversion
Industry 4.0: machine vision, real-time control, predictive maintenance systems
Autonomous driving: sensor fusion (LIDAR, camera, radar), high-precision positioning computation
Medical devices: medical image processing (CT/MRI), ultrasound imaging acceleration
Agilex™ 5 Series: Price-performance optimised edge computing solutions
Targeted at edge computing and embedded vision applications, the Agilex™ 5 Series maintains the benefits of the Agilex™ architecture while optimising the design to achieve a more competitive price point, making it ideal for Industrial Internet of Things (IIoT), smart cameras and in-vehicle information systems.
Key Features:
Optimised logic density: 50K-300K logic cell options to balance performance and cost
Enhanced DSP resources: Optimised for computer vision and lightweight AI inference, supporting INT8/FP16 operations
Rich interface integration: integrated USB 3.0, GigE, MIPI CSI-2 and other interfaces to simplify the camera and sensor connections
Low-power design: 30% lower static power consumption than its predecessor, suitable for battery-powered devices
Application Scenario Advantage:
Edge AI: AI functions such as face recognition and object detection are implemented on the device side, reducing cloud dependency
Industrial vision: production line quality inspection, QR code reading, product classification
In-vehicle system: surround view camera processing, driver monitoring, in-vehicle infotainment
Smart Cities: traffic flow analysis, licence plate recognition, public safety monitoring
Agilex™ 3 Series: Revolutionising Entry-Level FPGAs
The Agilex™ 3 series is the entry-level product in the Agilex™ family, targeting cost-sensitive applications while inheriting the core strengths of the Agilex™ architecture and providing a smooth upgrade path for users of the traditional Cyclone and MAX series.
Product Positioning and Features:
Low-cost design: Using mature process nodes to provide highly competitive cost per logic cell
Low-power operation: Static power consumption of less than 100mW, suitable for consumer electronics and portable devices.
Fast startup: supports instantaneous startup configurations to meet industrial control real-time requirements
Enhanced ease of use: Simplifies clock management and power design, lowering the development barrier
Typical application areas:
Consumer electronics: smart home control, sensor fusion for wearable devices
Industrial control: PLC, motor drive, HMI interface
Communication equipment: low-end network switching, protocol converters
Education market: FPGA teaching and prototyping
Time:2025-06-21
Time:2025-06-21
Time:2025-06-21
Time:2025-06-21
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