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Nexperia recently announced the launch of a new product portfolio featuring CFP2-HP packaging, which includes 16 optimized low VF planar Schottky diodes. The new product portfolio includes eight industrial-grade products (such as PMEG6010EXD) and eight products certified by EC-Q101 (such as PMEG4010EXD-Q). This product release is to support the development trend of manufacturers replacing SMA/B/C type package devices with smaller-sized CFP package devices, especially in automotive applications. The newly launched diodes are suitable for scenarios such as DC-DC conversion, freewheeling, anti-reverse protection, or hiccup circuits.

To achieve design flexibility as much as possible, the new product portfolio offers A reverse voltage VR(max) of 20 V to 60 V and A forward current IF(average) of 1 A to 2 A. The CFP2-HP adopts an exposed heat sink, thus being able to provide an extremely high level of heat dissipation efficiency (Ptot) in a small package size. The package size of CFP2-HP is 2.65mm x 1.3mm x 0.68mm (including pins).

Frank Matschullat, the product group manager of Nexperia's power bipolar discrete devices, said: "With the increasing popularity of high-performance microcontrollers, the industry is shifting towards multi-layer printed circuit boards, and packaging has thus become a key part of the heat dissipation system." Smaller packages such as CFP can offer more efficient heat dissipation performance. Nexperia also takes this as the core in its active promotion of the transformation of multi-layer printed circuit boards. The latest CFP packaging technology is specifically designed for multi-layer PCBS, which can provide the same electrical performance on a smaller board area, reducing component and system costs. By making significant investments to expand production capacity, we have made adequate preparations to meet the increasingly strong market demand for CFP packaged products. CFP packaged products are crucial for ensuring that automotive and industrial applications adapt to the continuously growing demands in the future and maintain market competitiveness.

The CFP package adopts a copper wafer design, which can meet the strict requirements for high efficiency and miniaturization design. Nowadays, CFP packaging can be used in various power diode technologies, such as Nexperia's Schottky rectifier diodes and recovery rectifier diodes. Soon, it will also be extended to bipolar transistors, greatly enhancing product diversity. This will further consolidate Nexperia's advantages in the field of packaging innovation. Relying on the reliable supply chain established by Nexperia as a semiconductor manufacturer, it will provide customers with a rich and diverse range of device choices.

A product portfolio of low IR optimized planar Schottky diodes specifically designed for automotive and industrial applications will be launched in May. For more information on Nexperia planar Schottky diodes in CFP2-HP package, please visit: www.nexperia.com/cfp

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