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Hengxuan Technology's new generation of 2700 series chips has customers releasing terminal products
According to Hengxuan Technology, the freebudspro2 headset released by Huawei in July uses the companys latest BES2700 series main controller.
On August 4, Hengxuan Technology stated in the investor relations activity record sheet that the company's new generation of 2700 series chips has begun to release customer terminal products one after another, and Q3 has begun to enter the stocking stage.
According to Hengxuan Technology, the freebudspro2 headset released by Huawei in July adopts the company's latest BES2700 series main control, and it is expected that other brand customers will be released in the second half of the year.
At present, Hengxuan Technology's customers are mainly divided into three categories, namely mobile phone brands, professional audio manufacturers and Internet companies. Among them, the TWS earphones of mobile phone brand manufacturers are connected with their smartphone ecosystems and are convenient to use. Therefore, mobile phone manufacturers are currently the most important participants in TWS earphones, and at the same time drive the innovation of TWS earphones.
Regarding the research and development situation, Hengxuan Technology said that in the past few years, the company has expanded from a single TWS earphone chip product to the wearable and smart home fields. These markets have higher and higher requirements for chip performance, such as WiFi, from WiFi4 To WiFi6 and gradually iterate to WiFi7, it is necessary to gradually iterate from audio to audio and video. At the same time, audio technology itself is constantly evolving, and the architecture of SoC chips will become more and more complex. In terms of software, we are also making different products based on the same architecture and making different software systems in different markets to adapt to future development. Therefore, in this process, more R&D personnel are needed to optimize and iterate at each technical point, and to build a more and more powerful chip software and hardware system platform, so that the company's core competitiveness can be stronger.
Time:2024-11-16
Time:2024-11-16
Time:2024-11-16
Time:2024-11-16
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