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Samsung's HBM3E certification blocked, Google AI chip has notified withdrawal of supplier
April 27 news, Digitimes reported on the 25th, Samsung Electronics in the field of HBM suffered technical verification bottlenecks, due to failure to pass the NVIDIA certification was removed from the TSMC CoWoS package production line. For the sake o…
April 27 news, Digitimes reported on the 25th, Samsung Electronics in the field of HBM suffered technical verification bottlenecks, due to failure to pass the NVIDIA certification was removed from the TSMC CoWoS package production line. For the sake of insurance, Google's self-research AI server chip originally planned to support Samsung's HBM3E will also be replaced by Micron's products.
Samsung responded to Digitimes that it was ‘unable to comment on customer-related matters, and the relevant development programme is still being implemented according to schedule’. As of IT home press release, Google has still not issued a response.
Supply chain sources said that Samsung HBM3E was originally scheduled for 2025 Q1 to NVIDIA volume shipments, but NVIDIA has not yet announced the final certification results. Google's change of supplier is seen as an important signal that certification is blocked.
SK Hynix is currently making the most progress in the 12-layer HBM3E space, with recent rumours suggesting that NVIDIA's GB300 design change will affect its shipments, but the two sides will need to negotiate a year in advance as the supply of high-end HBMs continues to outstrip demand.
SK Hynix's 12-layer HBM3E yields remain ahead of the curve and sales figures are expected to grow steadily, with Q2 2025 sales expected to account for more than half of the overall HBM3E share.
Time:2025-04-30
Time:2025-04-30
Time:2025-04-30
Time:2025-04-30
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