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The ultra-compact, flexible memory chip improves SWaP for advanced missions targeting satellites for communications, Earth observation, science, and edge computing. A qualified engineering sample (EM) of 8GB DDR4 is now available, and a flying positive (FM) is being manufactured for launch in early 2025.

Ultra-fast, high-density 8GB DDR4 memory offers the same form factor and pin compatibility as the smaller 4GB DDR4 option - ideal for next-generation designs. The new high-speed 8GB DDR4 memory supports a transfer rate of 2400MT/s. It is immune to single particle latches (sels) up to 60 MeV.cm2/mg. In addition, the device provides a total ionization dose (TID) of 100 krad, and we have SEU data of up to 60 MeV.cm2/mg.

Teledyne e2v Double Capacity Space-grade 8GB DDR4 memory chip Teledyne e2v has announced the successful certification of its 8GB space-grade DDR4 memory as part of its edge computing solution in Space.

This also marks the end of Teledyne e2v's initial DDR4 certification, including all screening (temperature cycling, structural analysis, C-SAM/ confocal scanning acoustic microscopy, pretreatment, temperature humidity deviation...). And radiation testing. As the demand for compact, high-density memory surges, Teledyne e2v emphasizes that its new memory chips are compatible with all of today's high-end astronaut-grade processing devices. This long list of processors includes AMD/Xilinx VERSALR ACAP, aerospace grade FPGas, MPSOC, Microchip RT PolarFire, and many proprietary ASIC products.

"High-speed memory is a key component of modern data-intensive satellites. The new 8GB device is the same compact form factor as our previous 4GB device, but with twice the storage density. In addition, with multiple temperature grades and certification options up to NASA Class 1, Teledyne e2v offers a diverse, rugged and versatile portfolio of aerospace grade products." Says Thomas Guillemain, Marketing and Business Development Manager for Data and processing Systems.

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