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Texas Instruments(TI) has introduced new power management chips to meet the rapidly growing power needs of modern data centers. With the increasing adoption of high-performance computing and artificial intelligence (AI), data centers demand higher power density and more efficient solutions. Texas Instruments' new TPS1685 is a 48-V integrated hot-swappable electronic fuse with power path protection that helps customers meet their data center hardware and processing needs. To simplify data center design, Texas Instruments also introduced a new family of integrated GaN power stages in the industry-standard TOLL package, the LMG3650R035, LMG3650R025 and LMG3650R070.

"With the increasing demand for energy in data centers, the global digital infrastructure power sector is turning to smarter and more efficient semiconductors," said Robert Taylor, general manager, Industrial Power Design Services, Texas Instruments. "Advanced chips drive the computing power of artificial intelligence, and analog semiconductors are key to improving energy efficiency. Our innovative power management technology enables data centers to reduce their environmental impact while helping us meet the growing demands of the digital world."

Power levels above 6kW are achieved through intelligent system protection

As power demand surges, data center designers are turning to 48V power architectures to improve efficiency and scalability to better support components such as cpus, graphics processing units, and AI hardware accelerators. Texas Instruments' 48V stackable integrated hot-swappable electronic fuses with power path protection enable designers to meet high-power (>6kW) processing needs with scalable devices, compared to existing hot-swappable controllers on the market. The device simplifies the design and reduces the solution size by half.

To learn more about designing with the TPS1685, read the technical article "Powering Modern AI data centers with Integrated 48V Hot-swappable Devices (Electronic Fuses)."

Texas Instruments' GaN power stages in industry-standard packages allow for greater efficiency

In addition, TI introduced a new family of integrated GaN power stages. The LMG3650R035, LMG3650R025 and LMG3650R070 take advantage of TI's GaN in industry-standard TOLL packages, allowing designers to take advantage of TI GaN's efficiency without the need for costly and time-consuming redesigns.

The new power stage integrates a high-performance gate driver with a 650V GaN field-effect transistor (FET), achieving both high efficiency (>98%) and high power density (>100W/in3). These devices also incorporate advanced protection features, including overcurrent protection, short circuit protection, and overtemperature protection. This is particularly important for AC/DC applications such as server power, where designers are challenged to deliver more power in a smaller space.

To learn more about TI's GaN power stages in industry-standard packages, read the technical article "Driving Power Design Innovation with Highly Integrated TOLL Packaged GaN Devices."

Packaging, availability

The TPS1685, LMG3650R035, LMG3650R025 and LMG3650R070 support pre-production and are now available for purchase through TI.com.

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