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Melexis, a global microelectronics engineering company, has announced the launch of a dual-mode package (DMP) version of its MLX90425 magnetic position sensor chip, further expanding its family of magnetic position sensors. The new device follows the same package design as the existing MLX90364 and MLX90421, providing an easy upgrade path for automotive Tier 1 suppliers and original equipment manufacturers (OEMs). The chip is capable of 360° rotational detection with magnetic induction and has excellent stray field interference (SFI) immunity, precisely responding to the automotive industry's need for high-precision position detection and immunity to interference.

The MLX90364 and MLX90421 DMP packaged versions of Melexis have been very successful in the internal combustion engine (ICE) automotive field, and are widely used in throttle position, exhaust gas recirculation (EGR) systems, transmission position, and other actuator or motion feedback systems to provide accurate position feedback information for vehicles. As automakers transition from traditional ICE-driven vehicles to more sustainable, high-voltage hybrid systems, greater demands are being placed on the stray field interference (SFI) immunity of electronic components to ensure that magnetic induction chips provide accurate inductive feedback.

Based on the proven DMP package design and PIN layout of the MLX90364 and MLX90421, the MLX90425 introduces Melexis' latest magnetic position sensing technology in a traditional package familiar to engineers, providing the automotive market with a seamless and cost-effective upgrade solution that avoids the need for extensive redesign of components or tooling.

Klaus Wilczek, Global Marketing Manager at Melexis, commented: ‘As the automotive market transitions to sustainability, the industry needs innovative solutions to develop new, more cost-effective high-voltage hybrid powertrains, and the MLX90425 demonstrates our commitment to our customers and product design. The product offers advanced SFI magnetic induction technology in a package familiar to engineers, avoiding extensive redesign and retrofit efforts, resulting in significant cost savings for our customers.’