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Qualcomm Bluetooth 5.3 QCC5171_QCC-5171-0-WLNSP99-TR-04-0 Bluetooth Audio SoC

Qualcomm Bluetooth 5.3 QCC5171_QCC-5171-0-WLNSP99-TR-04-0 Bluetooth Audio SoC

Source:our siteTime:2023-10-16Views:

Shenzhen Mingjiada Electronics Co., Ltd. supplies and recycles Qualcomm Bluetooth 5.3 QCC5171_QCC-5171-0-WLNSP99-TR-04-0 Bluetooth Audio SoCsProduct DescriptionThe Qualcomm QCC5171 Bluetooth audio SoC is part of the Qualcomm S5 (QCC517x) audio platfor…

Shenzhen Mingjiada Electronics Co., Ltd. supplies and recycles Qualcomm Bluetooth 5.3 QCC5171_QCC-5171-0-WLNSP99-TR-04-0 Bluetooth Audio SoCs


Product Description

The Qualcomm QCC5171 Bluetooth audio SoC is part of the Qualcomm S5 (QCC517x) audio platform. The Qualcomm S5 audio platform is optimized for AI, providing ultra-low power performance while tripling computing power compared to its predecessor. The Qualcomm S5 audio platform supports Bluetooth 5.3 dual-mode and the new LE Audio use case; and Qualcomm Snapdragon Sound Snapdragon audio technology, which enables 16bit/44.1kHz CD-grade lossless Bluetooth sound quality and 24bit/96KHz high-resolution audio.


Snapdragon Sound Snapdragon Sound supports Qualcomm aptX audio codecs, including aptX Adaptive Audio; aptX Voice Ultra Wideband voice technology, 8th generation Qualcomm cVc echo cancellation and noise suppression; and integrated Qualcomm Adaptive Active Noise Cancellation (ANC) technology, including feed-forward, feed-back, hybrid, and adaptive, through the Qualcomm Extensions to support third-party innovation.


Core Technology Benefits:

Supports Bluetooth 5.3 specification;

Support for Aptx Adaptive 96kHz and Aptx Adaptive Lossless, Aptx Voice;

Support for LE Audio Broadcast Receiver (BMR), LE Audio Unicast Music Receiver (UMR) and stereo recording;

Support for Qualcomm 3rd generation ANC (noise reduction up to -36db);

Support for Qualcomm 3mic bone conduction ENC;

Support for Qualcomm TWM technology;

Support for Google and Amazon voice assistants;

Support Google Fastpair and Microsoft Swift Pair.

Item Specifications: 99-ball 4.930 mm × 3.936 mm × 0.57 mm, 0.4 mm pitch WLCSP CPU:

4-core architecture with dual MCUs and dual DSPs;

32-bit RISC MCU up to 80MHz, 160KB data RAM, 32KB cache, 128KB TCM, 64KB shared RAM;

DSP up to 240MHz, 384KB program RAM, 1408KB data RAM.


About Qualcomm

Qualcomm is the world's leading innovator of wireless technology and a driving force in the development, commercialization and scaling of 5G. We are committed to inventing breakthrough fundamental technologies. Transforming the way the world connects, computes and communicates. Connecting cell phones to the Internet, Qualcomm's inventions ushered in the era of mobile connectivity. Today, Qualcomm's foundational technologies empower the entire mobile ecosystem, with inventions in every 3G, 4G and 5G smartphone.Qualcomm brings the benefits of mobile technology to new industries such as automotive, IoT, computing and more, creating a whole new world in which people and things can communicate and interact smoothly.


Recycling specific process:

1、You will be backlogged IC / module inventory for simple classification, to determine the model, brand, production date, quantity and so on;

2、Please send the inventory list to our evaluation team by fax or e-mail;

3、Waiting for the company's professionals to make a purchase offer, after reaching an agreement, the two sides will discuss the specific transaction method for delivery;

4、Only recycle formal channel sources, such as agents, traders, terminal factories, etc., do not accept not formal channel sources.


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