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Global 300mm Semiconductor Fab Capacity Expected to Reach Record High in 2026
Global semiconductor manufacturers are expected to increase 300mm fab capacity to a record 9.6 million wafers per month (wpm) in 2026, according to the latest SEMI report. After strong growth in 2021 and 2022, 300mm capacity expansion is expected to s…
Global semiconductor manufacturers are expected to increase 300mm fab capacity to a record 9.6 million wafers per month (wpm) in 2026, according to the latest SEMI report. After strong growth in 2021 and 2022, 300mm capacity expansion is expected to slow this year due to weak demand for memory and logic devices.
While the pace of global 300mm fab capacity expansion is slowing, the industry remains firmly focused on adding capacity to meet the strong long-term demand for semiconductors," said Ajit Manocha, president and CEO of SEMI. "The foundry, memory and power sectors will be the main drivers of the record capacity growth expected in 2026."
Chipmakers expecting to add 300mm fab capacity over the forecast period 2022 to 2026 to meet the growth in demand include GlobalFoundries, Hua Hong Semiconductor, Infineon, Intel, Kioxia, Micron, Samsung, SK Hynix, SMIC, STMicroelectronics, Texas Instruments, TSMC and UMC.These companies are planning 82 new facilities and production lines to begin operations from 2023 to 2026.
The SEMI report shows that from 2022 to 2026, analog and power lead the rest of the industry in capacity growth with a CAGR of 30%, followed by foundry at 12%, optoelectronics at 6% and memory at 4%.
Time:2025-05-08
Time:2025-05-08
Time:2025-05-08
Time:2025-05-08
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