sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:LCMXO3L-4300C-6BG324I
Data Manual:LCMXO3L-4300C-6BG324I.pdf
Brand:Lattice
Particular Year:23+
Package:324-CABGA
Delivery Date:New and Original
Stock: 1000pcs
LCMXO3L-4300C-6BG324I is an Ultra-Low Density family that supports the most advanced programmable bridging and I/O expansion. It has
the breakthrough I/O density and the lowest cost per I/O. The device I/O features have the integrated support for latest industry standard I/O.
Product Features
Smallest footprint, lowest power, high data throughput bridging solutions for mobile applications
Optimized footprint, logic density, I/O count, I/O performance devices for I/O management and logic applications
High I/O logic, lowest cost I/O, high I/O devices for I/O expansion applications
Logic Density ranging from 64 to 9.4 k LUT4
High I/O to LUT ratio with up to 384 I/O pins
Schmitt trigger inputs, up to 0.5 V hysteresis
Optional dual boot with external SPI memory
Single-chip, secure solution
Programmable through JTAG, SPI or I2C
Flexible On-Chip Clocking
Eight primary clocks
Up to two edge clocks for high-speed I/O interfaces (top and bottom sides only)
Wide input frequency range (7 MHz to 400 MHz).
Enhanced System Level Support
On-chip hardened functions: SPI, I2C, timer/counter
On-chip oscillator with 5.5% accuracy for commercial/industrial devices
Applications
Consumer Electronics
Compute and Storage
Wireless Communications
Industrial Control Systems
Automotive System
Model
Brand
Package
Quantity
Describe
Xilinx
196-CSPBGA
1000
Spartan®-7 Field Programmable Gate Array (FPGA) IC,196-TFBGA, CSBGA
Microchip
BGA-784
2000
PolarFire® FPGA IC based on 28 nm non-volatile process technology
Microchip
BGA-484
2000
PolarFire® FPGA IC based on 28 nm non-volatile process technology
Microchip
BGA-484
2000
PolarFire® FPGA IC based on 28 nm non-volatile process technology
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