sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:XCZU6CG-L2FFVC900E
Data Manual:XCZU6CG-L2FFVC900E.pdf
Brand:AMD
Particular Year:23+
Package:900-FCBGA
Delivery Date:New and Original
Stock: 1000pcs
The XCZU6CG-L2FFVC900E is based on the Xilinx UltraScale™ MPSoC architecture. The XCZU6CG-L2FFVC900E is based on the Xilinx UltraScale™ MPSoC architecture, which is based on the feature-rich, 64-bit, quad-core or dual-core Arm® Cortex®-A53 and dual-core Arm Cortex-R5F processing systems (based on the Xilinx UltraScale™ MPSoC). It also features on-chip memory and multi-port external memory interfaces, and extensive peripheral connectivity.
Product Attributes
Architecture: MCU, FPGA
Core processors: Dual-core ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual-core ARM® Cortex™-R5 with CoreSight™
RAM size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Key Attributes: Zynq® UltraScale+™ FPGA, 469K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package/Housing: 900-BBGA, FCBGA
Vendor Device Package: 900-FCBGA (31x31)
Number of I/Os: 204
Applications
● CG equipment
● Sensor processing and fusion
● Motor control
● Low-cost ultrasound
● Traffic engineering
Model
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