sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:MAXM17552AMB
Data Manual:MAXM17552AMB.pdf
Brand:Apple
Particular Year:23+
Package:USLIC-10
Delivery Date:New and Original
Stock: 1400pcs
MAXM17552AMB Application Apple AirPods Max Headset Headphones w/100mA Step-Down Power Module
The MAXM17552 Himalaya uSLIC™ compact step-down power supply module is part of the Himalaya family of voltage regulator ICs, providing better heat dissipation, smaller size, and simpler power solutions.
The MAXM17552 is a high-efficiency, synchronous step-down DC-DC power supply module that includes an integrated controller, MOSFETs, compensation components and inductors.
The device operates over a wide input voltage range of 4V to 60V and provides output currents of up to 100mA. The device has a programmable output voltage range of 0.9 V to 5.5 V. The MAXM17552 provides a true plug-and-play power solution that significantly reduces design complexity and manufacturing risk, and shortens time-to-market. The module features a peak current mode control architecture with soft-start features, including a default soft-start time of 5.1 ms. The MAXM17552 features ±1.75 percent feedback voltage accuracy and fixed frequency PWM in a thin 10-pin 2.6mm x 3mm x 1.5mm μSLIC™ package.
Specification
Type: Non-isolated PoL module
Number of outputs: 1
Voltage - Input (min): 4V
Voltage - Input (max): 60V
Voltage - Output: 1 0.9 ~ 5.5V
Current - Output (Max): 100mA
Application: ITE (Commercial)
Characteristics: OCP, OTP, SCP, UVLO
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount Type
Package / Housing: 10-SMD Module
Size / Dimension: 0.12" L x 0.10" W x 0.06" H (3.0mm x 2.6mm x 1.5mm)
Supplier Device Package: 10-eMGA (3x2.6)
Applications
● Industrial sensors and encoders
● 4mA-20mA current loop powered sensors
● LDO replacement
● HVAC and building controls
● Battery-powered equipment
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Apple Inc. (NASDAQ: AAPL, LSE: ACP), formerly known as Apple Computer, Inc. and announced at the Macworld Expo in San Francisco on January 9, 2007, changed its name to its current name. Headquartered in Cupertino, California, the companys core busines…
339S01015
Recently the well-known foreign disassembly organisation iFixit carried out a chip-level disassembly of the Vision Pro, and the following is the internal chip structure of the Vision Pro:Step 3: Connecting chips on the front of the motherboardRed: USI…338S00521
Recently iFixit, a well-known foreign disassembly organisation, carried out a chip-level disassembly of the Vision Pro, and the following is the internal chip structure of the Vision Pro:Step 2: Front of the motherboardRed: Apple 338S00521-B0 Power Ma…343S00629
Recently iFixit, a well-known foreign disassembly organisation, carried out a chip-level disassembly of the Vision Pro, and the following is the internal chip structure of the Vision Pro:Step 1: Front of the motherboardRed: Apple APL1109/339S01081E M2…343S00628
Recently iFixit, a well-known foreign disassembly organisation, carried out a chip-level disassembly of the Vision Pro, and the following is the internal chip structure of the Vision Pro:Step 1: Front of the motherboardRed: Apple APL1109/339S01081E M2…343S00627
Recently iFixit, a well-known foreign disassembly organisation, carried out a chip-level disassembly of the Vision Pro, and the following is the internal chip structure of the Vision Pro:Step 1: Front of the motherboardRed: Apple APL1109/339S01081E M2…339S01186
Recently iFixit, a well-known foreign disassembly organisation, carried out a chip-level disassembly of the Vision Pro, and the following is the internal chip structure of the Vision Pro:Step 1: Front of the motherboardRed: Apple APL1109/339S01081E M2…Contact Number:86-755-83294757
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