sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:TPS259570DSGR
Data Manual:TPS259570DSGR.pdf
Brand:Apple
Particular Year:23+
Package:WSON8
Delivery Date:New and Original
Stock: 60000pcs
TPS259570DSGR Application Apple Macbook AIR/eFuse
The TPS2595xx series eFuse (Integrated FET Hot Swap Device) is a highly integrated, compact circuit protection and power management solution. The devices provide multiple protection modes with few external components and are robust against overloads, short circuits, voltage surges and excessive inrush currents.
Features
Wide input voltage range: 2.7V to 18V
Absolute maximum voltage: 20V
3V to 18V (TPS2595x5 version)
Low on-state resistance: RON = 34mΩ (typical)
Over-temperature protection (OTP)
Fast overvoltage protection clamp (3.8V, 5.7V and 13.7V) with 5µs response time (typical)
Adjustable current limit with load current monitor output (ILM)
Current range: 0.5A to 4A
Current limiting accuracy: ±7.5%
Adjustable output slew rate control (dVdt)
TPS2595x0, TPS2595x1, TPS2595x5: Active high enable input with adjustable undervoltage lockout (UVLO)
TPS2595x3: active low enable input with adjustable overvoltage lockout (OVLO)
Fault indication pin (FLT)
UL 2367 listed - file number E169910
RILM>=487Ω (4.42A max)
IEC 62368-1 approval
Safety during single point fault testing (IEC 62368-1)
ILM pin open/short detection
Applications
Hot-swapping
Adapter powered systems
Multifunction printers
SSD and HDD
Industrial Systems
White Goods
Set-top boxes
Digital TV
Model
Brand
Package
Quantity
Describe
A: all online goods on the shelves can be ordered online, but considering the large liquidity of spot inventory, it is not possible to achieve 100% accuracy at present. In case of any abnormality, you can contact our company online and give the corresponding solution.
A: our self-supporting products are from cooperative domestic and foreign original factories or authorized agents, and the source can be traced to ensure the original and authentic products.
A: at present, our self-employed brands TI,ST,ADI,NXP,LATTICE,CYPRESS,INFINEON,XILINX and other first-line brands. Other channels are the original factory and agency channels. If necessary, we can communicate and confirm according to the specific brand and model.
A: You can inquire through the website, or by phone and email.
A: the delivery date is marked in most commodity information. You can estimate the delivery time of the commodity according to the delivery date. The specific arrival time depends on the warehouse where the commodity is located and the logistics mode you choose.
A: you can issue ordinary invoices for individual users or special VAT invoices for enterprise users.
Apple Inc. (NASDAQ: AAPL, LSE: ACP), formerly known as Apple Computer, Inc. and announced at the Macworld Expo in San Francisco on January 9, 2007, changed its name to its current name. Headquartered in Cupertino, California, the companys core busines…
339S01015
Recently the well-known foreign disassembly organisation iFixit carried out a chip-level disassembly of the Vision Pro, and the following is the internal chip structure of the Vision Pro:Step 3: Connecting chips on the front of the motherboardRed: USI…338S00521
Recently iFixit, a well-known foreign disassembly organisation, carried out a chip-level disassembly of the Vision Pro, and the following is the internal chip structure of the Vision Pro:Step 2: Front of the motherboardRed: Apple 338S00521-B0 Power Ma…343S00629
Recently iFixit, a well-known foreign disassembly organisation, carried out a chip-level disassembly of the Vision Pro, and the following is the internal chip structure of the Vision Pro:Step 1: Front of the motherboardRed: Apple APL1109/339S01081E M2…343S00628
Recently iFixit, a well-known foreign disassembly organisation, carried out a chip-level disassembly of the Vision Pro, and the following is the internal chip structure of the Vision Pro:Step 1: Front of the motherboardRed: Apple APL1109/339S01081E M2…343S00627
Recently iFixit, a well-known foreign disassembly organisation, carried out a chip-level disassembly of the Vision Pro, and the following is the internal chip structure of the Vision Pro:Step 1: Front of the motherboardRed: Apple APL1109/339S01081E M2…339S01186
Recently iFixit, a well-known foreign disassembly organisation, carried out a chip-level disassembly of the Vision Pro, and the following is the internal chip structure of the Vision Pro:Step 1: Front of the motherboardRed: Apple APL1109/339S01081E M2…Contact Number:86-755-83294757
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