sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:SoC FPGA
Brand:Xilinx
Particular Year:24+
Package:FBGA-1517
Delivery Date:New and Original
Stock: 3000pcs
The XCZU19EG-2FFVB1517E is part of a broad portfolio of Zynq UltraScale+ EG devices for next-generation applications. Its ultra-miniaturized package delivers a 60 percent reduction in size and 70 percent reduction in thickness for high-computing-density devices, higher thermal dissipation performance, and higher signal integrity without compromising the processing power of the Zynq UltraScale+ MPSoC.
XCZU19EG-2FFVB1517E Device Specifications:
Product Category: SoC FPGA
Mounting Style: SMD/SMT
Package / Case: FBGA-1517
Cores: ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2
Number of Cores: 7 Core
Maximum Clock Frequency: 600 MHz, 667 MHz, 1.5 GHz
L1 Cache Instruction Memory: 2 x 32 kB, 4 x 32 kB
L1 cache data memory: 2 x 32 kB, 4 x 32 kB
Program memory size: -
Data RAM size: -
Number of Logic Elements: 1143450 LE
Adaptive Logic Module - ALM: 65340 ALM
Embedded memory: 34.6 Mbit
Number of inputs/outputs: 660 I/O
Operating supply voltage: 850 mV
Minimum operating temperature: 0 C
Maximum operating temperature: + 100 C
Distributed RAM: 9.8 Mbit
Embedded Block RAM - EBR: 34.6 Mbit
Humidity sensitivity: Yes
Number of logic array blocks - LAB: 65340 LAB
Number of transceivers: 72 Transceiver
Product Type: SoC FPGA
Family: XCZU19EG
Number of Factory Packages: 21
Sub Category: SOC - Systems on a Chip
Trademark: Zynq UltraScale+
Model
Brand
Package
Quantity
Describe
Microchip
TFBGA-325
2000
SmartFusion®2 SoC FPGA based on 166MHz Arm® Cortex®-M3 CPU
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