sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:AGFB008R24D2E3V
Brand:Intel
Particular Year:24+
Package:2340-BFBGA
Delivery Date:New and Orignal
Stock: 1000pcs
AGFB008R24D2E3V features advanced Intel 10nm SuperFin and Intel 7 technologies, second generation Intel Hyperflex™ FPGA architecture, high system integration, SmartVID standard power devices, power islands, power gating, and other power reduction technologies.
Product Attributes
Architecture: MPU, FPGA
Core Processor: Quad-Core ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, floating point
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Key Attributes: FPGA - 764K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package/Housing: 2340-BFBGA Exposed Pad
Supplier Device Package: 2340-BGA (45x42)
Model
Brand
Package
Quantity
Describe
Intel
1152-FBGA
1000
Embedded - System-on-Chip (SoC) IC Stratix® 10 SX FPGA-650K Logic Element 1.5GHz 1152-FBGA (35x35)
Intel
1152-FBGA
1000
Embedded - System-on-Chip (SoC) IC Stratix® 10 SX FPGA-650K Logic Element 1.5GHz 1152-FBGA (35x35)
Intel
1152-FBGA
1000
Embedded - System-on-Chip (SoC) IC Stratix® 10 SX FPGA-650K Logic Element 1.5GHz 1152-FBGA (35x35)
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Intel is a global leader in the semiconductor industry and computing innovation, founded in 1968. Today, Intel is transforming into a data-centric company. Together with its partners, Intel promotes innovation and application breakthroughs in transfor…
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Xeon Gold processors is optimized for demanding AI, mainstream data center, multi-cloud compute, and network and storage workloads. With support for higher memory speeds and enhanced memory capacity, these processors deliver advanced performance, ener…Contact Number:86-755-83294757
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