sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:XC7A35T-1FG484I
Data Manual:XC7A35T-1FG484I.pdf
Brand:AMD
Particular Year:23+
Package:484-FBGA
Delivery Date:New and Original
Stock: 2000pcs
The XC7A35T-1FG484I features the next level of integration efficiently achieved with standalone dual 12-bit, 1MSPS, 17-channel analogue-to-digital converters in Artix-7 FPGAs.
Artix-7 FPGAs are part of a fully programmable, cost-optimised portfolio that includes Spartan-6 and Spartan-7 FPGAs for I/O optimisation and the Zynq®-7000 fully programmable SoC for application-specific system integration and optimisation. the Artix-7 FPGAs are available in small, compact packages with a very small footprint.
Specification
Series: Artix-7
Number of LAB/CLBs: 2600
Number of logic elements/cells: 33280
Total RAM bits: 1843200
Number of I/O: 250
Voltage - Supply: 0.95V ~ 1.05V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package/Housing: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)
Features
6.6Gb/s transceiver for 211Gb/s peak bandwidth (full duplex)
Single/dual differential I/O standard at speeds up to 1.25Gb/s
740 DSP48E1 slices with up to 930 GMAC signal processing power
1,066Mb/s DDR3 memory with SODIMM support
Over 200 DMIP MicroBlaze processors for microcontroller, real-time processor or application processor configurations
Integrated memory interface for simplified access
50% reduction in total power consumption compared to previous generation
Low-power performance in the 13K-2,000K logic cell range
2 more logic, 2.5 more Block RAM and 5.7 more DSP slices than Spartan®-6 FPGAs
Ultra-low power (-1LI) to meet industry speed grade requirements
Widely used and proven 28nm process, architecture and quality
Integrated IP modules for shorter development cycles and reduced risk
Integrated wizard for rapid development of built-in modules
Bare metal, freeRTOS and Linux support for MicroBlaze processors with drag-and-drop peripherals
Development kits with IP and reference designs for quick design starts
Low-cost, wire-soldered, chip-scale BGA package
High level of system integration in a 10x10mm package
Package migration is possible across the entire family
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