sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:RK2206
Brand:Rockchip
Particular Year:23+
Package:BGA
Delivery Date:New and Original
Stock: 1000pcs
The RK2206 is a low-power, highly-integrated MCU-based wireless LAN processor. It can be used in different application areas such as Internet of Things (loT), wearables, home automation, cloud connectivity, etc. The RK2206 integrates a Cortex-M4F with I/D caching to run the operating system and applications, a Cortex-MO with 1/D caching to run the WLAN MAC stack, and a HiFI3 DSP to run algorithms related to audio and smart voice interaction. The HiFI3 DSP can be used to run algorithms related to audio and intelligent voice interaction. The integrated 480KB system memory and the XIP Flash/pSRAM interface give the RK2206 the flexibility to adapt to different application developments. The Multi-Chip Package (MCP) provides different capacities of on-chip Flash and pSRAM depending on application requirements.
The RK2206 supports 802.11b/g/n radio and full-media access control WLAN total solutions with integrated power amplifiers, transmit/receive switches, baluns, and low-noise amplifiers to reduce BOM costs. Optimized for high throughput in open office environments for smoother Internet applications. Supports automatic hardware calibration solutions to tune RF characteristics for optimal RF performance and avoid RF performance loss due to hardware board differences.The RK812 ASIC provides single-channel Dac and triple-channel ADCs for audio playback and intelligent voice interaction applications.A rich set of peripherals, such as USB2.OOTG, I2C, UART, PWM, SPI, CapSense, 12S, PDM, i8080 display interface, camera serial interface, etc., making product development easier and more diversified.
Equipped with RK812 ASIC, it directly supports battery power supply without external regulator, saving BOM cost. Embedded voice activity detection function can monitor voice at any time, respond to voice requests in time, quickly set up intelligent voice interaction applications, reduce hardware system power consumption, and improve battery life.
Product Features
CPU
- Cortex-M4F up to 200MHz
DSP
- Tensilica HiFi3 DSP up to 300MHz
Memory
- Built-in 256KB Sram, 192KB DTCM
- Internal 8/4 MB Flash
- Support EMMC, SD/MMC card
Audio ADC
- 3CH Audio-ADC,1CH Audio-DAC (with RK812)
- Class-D Amplifier (with RK812)
Interface
- Built-in power management (with RK812)
- DVP Sensor Interface
- USB2.0 OTG, SPI, UART, I2C, PDM, I2S
Display
- mcu/spi lcd interface Audio - Multi-format Audio Codecs
Audio - Multi-Format Audio Codec
- Multi-format audio codec
System
- Free Real-Time Operating System
Model
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Package
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